Abstract: In a solar cell module and a manufacturing method thereof according to an embodiment of the present invention, a solar cell (55) composed of a transparent electrode film, a photoelectric conversion layer and a back face electrode film is laminated on a light-transmitting insulating substrate (51). On the back face electrode film of the solar cell (55), an insulated lead wire (62, 63) and a back film (65) having an opening (65a) for drawing out an output lead portion (62a, 63a) of the lead wire (62, 63) are sequentially laminated. In such a solar cell module, an insulating sheet (11) is disposed between the back face electrode film of the solar cell (55) and the back film (65) so as to completely cover the opening (65a) of the back film (65). The insulating sheet (11) is disposed so as to cover the entire perimeter of the edge of the opening (65a) of the back film (65).

Abstract: A supporting structure (2) that stacks and supports solar cell modules in the horizontal state includes a base portion (23) stacked in the up-and-down direction, a reception portion (28) that supports the corner portions of the solar cell module that are projectingly formed in the lateral direction from the inner side wall surface (23c) of the base portion (23), an engaging convex portion (25) formed on the upper end surface of the base portion (23) and engaged with one of supporting structures adjacently arranged up and down, and an engaging concave portion (26) formed on the lower end surface (23b) of the base portion (23) and engaged with the engaging convex portion of the other of supporting structures adjacently arranged up and down, and wherein the engaging concave portion (26) is opened on the external side wall surface (23d) of the base portion (23).

Abstract: The object of this invention is to protect a solar panel with attaching a protection module to four corners of a solar panel. Another object is for preventing the protection module from falling off when a solar panel is lifted up or tilted. Further object is that protection modules prevent collapse of cargo piles when solar panels are accumulated. The protection module comprises perpendicular sidewalls 41 and stage-like insertion member 44. The sidewalls 41 cover two corner sides of the stacked solar panels. The insertion member 44 and the sidewalls 41 are molded integrally in such manner to connect two sides of the insertion member 44 to the inner surface 42 of the sidewalls 41. The insertion member 44 is inserted between the stacked solar panels. A bank 45 is formed on the upper surface of the insertion member 44. The bank 45 has hooking slopes 46 for holding the lower edge 34 of the frame of the solar panel by hooking on it. A terrace 47 is formed on the underside of the insertion member 44.

Abstract: Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film.

Abstract: A solar cell module that causes no cost increase and prevents an electrical contact between an Ag back-side conducting layer and a connection portion between an extraction wire and a draw wire. According to an embodiment of the present invention, in a solar cell module including a solar cell 55 composed of a surface substrate, a light-receiving side conducting layer, a semiconductor layer and a back-side conducting layer and having a wiring structure in which an extraction wire 60, 61 for extraction of current is connected to the back-side conducting layer, and a draw wire 62, 63 for outputting the current to the outside is connected to the extraction wire 60, 61, an isolation member 59 is disposed between a portion where the extraction wire 60, 61 and the draw wire 62, 63 are connected and the back-side conducting layer.

Abstract: In a solar cell module and a manufacturing method thereof according to an embodiment of the present invention, a solar cell (55) composed of a transparent electrode film, a photoelectric conversion layer and a back face electrode film is laminated on a light-transmitting insulating substrate (51). On the back face electrode film of the solar cell (55), an insulated lead wire (62, 63) and a back film (65) having an opening (65a) for drawing out an output lead portion (62a, 63a) of the lead wire (62, 63) are sequentially laminated. In such a solar cell module, an insulating sheet (11) is disposed between the back face electrode film of the solar cell (55) and the back film (65) so as to completely cover the opening (65a) of the back film (65). The insulating sheet (11) is disposed so as to cover the entire perimeter of the edge of the opening (65a) of the back film (65).

Abstract: In a solar cell module (1) according to an embodiment of the present invention, a reinforcement member (30) is bonded to a back film (87) of a solar cell panel (2) by an adhesive member (40) serving as an adhesive layer. The adhesive member (40) is interposed between the back film (87) and the reinforcement member (30) so as to protrude from a peripheral edge portion of an upper horizontal plate (31) of the reinforcement member (30). The distance between the peripheral edge portion of the upper horizontal plate (31) of the reinforcement member (30) and the back film (87) can thereby be increased and maintained, and insulation between the reinforcement member (30) and an Al layer included in the back film (87) can be increased.

Abstract: In one embodiment of a solar cell module having a configuration in which at least one module support member (30) is bonded with an adhesive (40) to a back film (25) of a solar cell module main body (10), a corner portion (38, 39) formed by a bottom face (35) of the module support member (30) that faces the back film (25) and each side face (36, 37) of the module support member is formed in a cut-out shape such as an R-chamfered shape, a C-chamfered shape, and a stepped shape, and an area including a cut-out part of the corner portion (38, 39) and up to each side face (36, 37) is covered with the adhesive (40).

Abstract: Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film.

Abstract: In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal driver chip mounted to a flexible substrate. The wires extending from the inner leads connected to the output terminals to the output outer leads do not need to travel around a liquid crystal driver chip. The flexible substrate can be scaled down. Yields can be increased.

Abstract: The reinforcement combining apparatus includes: a stage having a pressing surface; and a tool having a pressing surface opposite to the pressing surface of the stage, wherein the stage and the tool sandwich and press a flexible wiring substrate and a reinforcement, thereby combining the reinforcement with the flexible wiring substrate. A heat conduction rubber having elasticity which allows the heat conduction rubber to transform at an arbitrary area is provided as a part of the pressing surface of the tool, and the tool exerts pressure to the flexible wiring substrate via the heat conduction rubber. Thus, it is possible to bond the reinforcement to the flexible wiring with them uniformly appressed to each other.

Abstract: A semiconductor chip 6 is mounted on a flexible substrate 1 wherein internal connecting electrodes 4 to be connected to protruding electrodes 7 on an element surface of the semiconductor chip 6 and wires 3 for connecting the internal connecting electrodes 4 and the external connecting electrodes to be connected to external devices are provided on a surface of an insulating film 2. The internal connecting electrodes 4, the wires 3 and the surface of the insulating film 2 are coated with a protective film 5. The protruding electrodes 7 and the internal connecting electrodes 4 are connected by arranging the element surface of the semiconductor chip 6 to face the flexible substrate 1 and causing the protruding electrodes 7 on the element surface to pierce the protective film 5. This semiconductor device manufacturing method makes it possible to prevent ion migration and reduce occurrence of short circuit between wires.

Abstract: The flexible board of the present invention is formed so that a bent portion is formed by bending the film edge side of the connection terminal of an input outer lead formed on the surface of a film that has flexibility. A connection portion constructed of a portion corresponding to the connection terminal of the film and the bent portion is inserted in a recess portion of a connector provided for a main body circuit board. A stopper inside the recess portion pressurizes the bent portion, and the connection terminal of the input outer lead is connected to an electrode terminal via the bent portion and the portion of the film. By merely forming the bent portion at the film, the connection portion of the flexible board that conforms to the connector of a prescribed standard of ZIF or the like can be formed simply and inexpensively.

Abstract: In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal, driver chip mounted to a flexible substrate. The wires extending from the inner leads connected to the output terminals to the output outer leads do not need to travel around a liquid crystal driver chip. The flexible substrate can be scaled down. Yields can be increased.

Abstract: A coupling structure of electronic components, by which the break down of drive wiring at the time of folding a flexible substrate is prevented and the reliability of wiring is increased, is realized. In the coupling structure of electronic components of the present invention, a liquid crystal driver and a liquid crystal panel are arranged such that a surface of the flexible substrate, that surface being provided with the drive wiring and a solder resist, faces a surface of an element substrate, that surface being provided with display wiring. Furthermore, the drive wiring and the display wiring are electrically coupled to each other, and the solder resist is in contact with the element substrate.

Abstract: The flexible board of the present invention is formed so that a bent portion is formed by bending the film edge side of the connection terminal of an input outer lead formed on the surface of a film that has flexibility. A connection portion constructed of a portion corresponding to the connection terminal of the film and the bent portion is inserted in a recess portion of a connector provided for a main body circuit board. A stopper inside the recess portion pressurizes the bent portion, and the connection terminal of the input outer lead is connected to an electrode terminal via the bent portion and the portion of the film. By merely forming the bent portion at the film, the connection portion of the flexible board that conforms to the connector of a prescribed standard of ZIF or the like can be formed simply and inexpensively.

Abstract: A method for bonding a reinforcing plate to a flexible substrate, the method comprising the steps of: laminating a sheet-shaped thermosetting adhesive on a plate-like polyimide resin to prepare a reinforcing plate; drying the reinforcing plate so that its water content is decreased to the maximum allowable level or less; bonding the reinforcing plate to the flexible substrate through the adhesive by thermocompression bonding; and actually curing the adhesive by heating.

Abstract: A semiconductor chip 6 is mounted on a flexible substrate 1 wherein internal connecting electrodes 4 to be connected to protruding electrodes 7 on an element surface of the semiconductor chip 6 and wires 3 for connecting the internal connecting electrodes 4 and the external connecting electrodes to be connected to external devices are provided on a surface of an insulating film 2. The internal connecting electrodes 4, the wires 3 and the surface of the insulating film 2 are coated with a protective film 5. The protruding electrodes 7 and the internal connecting electrodes 4 are connected by arranging the element surface of the semiconductor chip 6 to face the flexible substrate 1 and causing the protruding electrodes 7 on the element surface to pierce the protective film 5. This semiconductor device manufacturing method makes it possible to prevent ion migration and reduce occurrence of short circuit between wires.

Abstract: The reinforcement combining apparatus includes: a stage having a pressing surface; and a tool having a pressing surface opposite to the pressing surface of the stage, wherein the stage and the tool sandwich and press a flexible wiring substrate and a reinforcement, thereby combining the reinforcement with the flexible wiring substrate. A heat conduction rubber having elasticity which allows the heat conduction rubber to transform at an arbitrary area is provided as a part of the pressing surface of the tool, and the tool exerts pressure to the flexible wiring substrate via the heat conduction rubber. Thus, it is possible to bond the reinforcement to the flexible wiring with them uniformly appressed to each other.

Abstract: A semiconductor device of a TCP or COF configuration is provided, including semiconductor chips mounted on a tape, which realizes compact mounting of a plurality of semiconductor chips on a single tape. In order to so, a semiconductor chip having a lengthwise rectangular shape is mounted so as to have a long side substantially perpendicular to an extending direction of a Cu wiring pattern, thereby wiring numerous wires of the Cu wiring patterns substantially in parallel with each other, and substantially straight-line with respect to a destination of in/output. Further, in the mounting of the plurality of semiconductor chips, a tape width can be reduced so as to miniaturize devices to be connected.