Abstract: [Problem] To provide a dispersion containing surface-modified silica nanoparticles highly dispersed in an organic dispersion medium and also having high transparency and storage stability. [Solution] Disclosed is a method for producing surface-modified silica nanoparticles comprising: preparing a first silica nanoparticle dispersion containing silica nanoparticles and an aqueous dispersion medium; replacing the aqueous dispersion medium in the first silica nanoparticle dispersion with an organic dispersion medium comprising at least one selected from cyclic esters or cyclic amides, to obtain a second silica nanoparticle dispersion; and mixing the second silica nanoparticle dispersion with a silane coupling agent represented by the formula (1): (each R1 is independently a hydrocarbon group of C1 to C20 and R2 is a hydrocarbon group of C1 to C3), to modify the surface of the silica nanoparticles.

Abstract: [Problem] To provide a dispersion containing surface-modified silica nanoparticles highly dispersed in an organic dispersion medium and also having high transparency and storage stability. [Solution] Disclosed is a method for producing surface-modified silica nanoparticles comprising: preparing a first silica nanoparticle dispersion containing silica nanoparticles and an aqueous dispersion medium; replacing the aqueous dispersion medium in the first silica nanoparticle dispersion with an organic dispersion medium comprising at least one selected from cyclic esters or cyclic amides, to obtain a second silica nanoparticle dispersion; and mixing the second silica nanoparticle dispersion with a silane coupling agent represented by the formula (1): (each R1 is independently a hydrocarbon group of C1 to C20 and R2 is a hydrocarbon group of C1 to C3), to modify the surface of the silica nanoparticles.

Abstract: Disclosed is a wafer-holding ring adapted for holding a wafer on a chemical mechanical polishing apparatus, which can prevent damage to a wafer, possesses excellent abrasion resistance, and can reduce replacement work and consequently can realize mass production of polished wafers. In the wafer-holding ring for a chemical mechanical polishing apparatus, the surface of the wafer-holding ring at least in its portion, which can come into contact with a wafer, is formed of a resin composition comprising not less than 30% by weight of polybenzimidazole.

Abstract: A coating composition comprising at least one polymer having carboxyl group, a polyfunctional epoxide-group-containing compound having at least one benzene or 5-, 6-, or 7-membered heterocyclic ring containing at least one heteroatom selected from nitrogen, oxygen or sulfur or cyclohexyl group or combinations thereof, and two or more epoxy groups, a reaction accelerator, and a solvent. This coating composition is excellent in storage stability, and can provide an excellent protective film.

Abstract: Disclosed is a wafer-holding ring adapted for holding a wafer on a chemical mechanical polishing apparatus, which can prevent damage to a wafer, possesses excellent abrasion resistance, and can reduce replacement work and consequently can realize mass production of polished wafers. In the wafer-holding ring for a chemical mechanical polishing apparatus, the surface of the wafer-holding ring at least in its portion, which can come into contact with a wafer, is formed of a resin composition comprising not less than 30% by weight of polybenzimidazole.

Abstract: The present invention is to provide a coating composition capable of forming a protective film excellent in adhesion properties. Such a coating composition comprises a specific polymer containing carboxyl group, a specific multifunctional epoxide-containing compound having two or more epoxy groups, an organic solvent, and an amino-containing silane coupling agent represented by the following general formula (I): H2N—R1—Si—(OR2)3  (I) wherein, R1 is an unsubstituted alkylene group, and R2's are independently an unsubstituted alkyl group.