Abstract: The present invention relates to a thermally conductive sheet 12 containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) contains an addition-curable silicone polymer (A1) and a non-reactive silicone oil (A2), the addition-curable silicone polymer (A1) accounting for 20% by mass or more and less than 100% by mass and the non-reactive silicone oil (A2) accounting for more than 0% by mass and 80% by mass or less relative to 100% by mass of the matrix resin (A). The thermally conductive sheet contains the thermally conductive inorganic particles (B) in an amount of 1000 to 3000 parts by mass relative to 100 parts by mass of the matrix resin (A). The thermally conductive sheet 12 is a cured sheet. 16 indicates an oil bleeding region. The present invention provides a thermally conductive sheet with reduced oil bleeding, and a method for producing the same.

Abstract: A thermally conductive composition includes a matrix resin, a curing catalyst, and thermally conductive particles. The thermally conductive particles include, with respect to 100 parts by mass of the matrix resin component, (a) 900 parts by mass or more of aluminum nitride with an average particle size of 50 ?m or more, (b) 400 parts by mass or more of aluminum nitride with an average particle size of 5 ?m or less, and (c) more than 0 parts by mass and 400 parts by mass or less of alumina with an average particle size of 6 ?m or less. A cured product of the thermally conductive composition has a thermal conductivity of 12 W/m·K or more and an Asker C hardness of 20 to 75. Thus, a thermally conductive composition having a hardness suitable for mounting to an electrical or electronic component and high thermal conductive properties, and a thermally conductive sheet using the thermally conductive composition are provided.

Abstract: A heat-resistant silicone resin composition contains a silicone resin and a heat resistance improver. The heat resistance improver is an organic polycyclic aromatic compound having one or more secondary amino groups and one or more ketone groups in a ring structure. The organic polycyclic aromatic compound maybe, e.g., quinacridone (P.V. 19) represented by the following Chemical Formula 2. A silicone resin composite material of the present invention includes the heat-resistant silicone resin composition and at least one filler selected from the group consisting of an inorganic filler and an organic filler. The at least one filler is contained in the heat-resistant silicone resin composition. Thus, the silicone resin composition and the silicone resin composite material have high heat resistance.

Abstract: A heat-resistant thermally conductive composition contains a matrix resin and thermally conductive particles, and contains a benzimidazolone compound as a heat resistance improver. Preferably, the benzimidazolone compound is a benzimidazolone pigment and is added in an amount of 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition. Preferably, the matrix resin component is a silicone polymer. Preferably, the heat-resistant thermally conductive composition has an Asker C hardness of 70 or less after curing. With these, provided are a heat-resistant thermally conductive composition and a heat-resistant thermally conductive sheet that use the heat resistance improver containing no metal atom and that are less likely to become hard at high temperature.

Abstract: A thermally conductive composition 26 contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W/mK or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.

Abstract: A thermally conductive sheet 10 contains a matrix resin 11, filler molded pieces 12 containing a first thermally conductive filler 15 with shape anisotropy, and a second thermally conductive filler 13. The filler molded pieces 12 contain a binder resin 14 and the first thermally conductive filler 15. The first thermally conductive filler 15 is oriented in the thickness direction of each of the filler molded pieces 12. The first thermally conductive filler 15 is also oriented in the thickness direction of the thermally conductive sheet 10 when present in the thermally conductive sheet 10. This configuration provides a thermally conductive sheet with a high thermal conductivity and a large size, and a method for producing the thermally conductive sheet.

Abstract: A thermally conductive composition includes a matrix resin, a curing catalyst, and thermally conductive particles. The thermally conductive particles include, with respect to 100 parts by mass of the matrix resin component, (a) 900 parts by mass or more of aluminum nitride with an average particle size of 50 ?m or more, (b) 400 parts by mass or more of aluminum nitride with an average particle size of 5 ?m or less, and (c) more than 0 parts by mass and 400 parts by mass or less of alumina with an average particle size of 6 ?m or less. A cured product of the thermally conductive composition has a thermal conductivity of 12 W/m·K or more and an Asker C hardness of 20 to 75. Thus, a thermally conductive composition having a hardness suitable for mounting to an electrical or electronic component and high thermal conductive properties, and a thermally conductive sheet using the thermally conductive composition are provided.

Abstract: A two-step curable thermally conductive silicone composition includes a silicone component, thermally conductive particles, and a curing component. The silicone composition includes (A) 100 parts by weight of polyorganosiloxane, (B) 100 to 2500 parts by weight of thermally conducive particles with respect to the component A, (C) a platinum group metal catalyst as a curing catalyst for the polyorganosiloxane, and (D) 0.01 to 5 parts by weight of organic peroxide with respect to the component A. The silicone composition has been subjected to primary curing at a primary curing temperature and is capable of undergoing secondary curing at a temperature higher than the primary curing temperature. The silicone composition after the primary curing has a thermal conductivity of 0.2 to 17 W/m·K and an Asker C hardness of 5 to 80.

Abstract: A plasma processing apparatus includes a thermally conductive silicone sheet between a mounting table and a focus ring. The thermally conductive silicone sheet has 100 parts by weight to 2000 parts by weight of thermally conductive particles with respect to 100 parts by weight of polyorganosiloxane, and the sheet has a thermal conductivity of 0.2 W/m·K to 5 W/m·K. Further, when the sheet has a shape of 38 mm in length, 38 mm in width, and 3 mm in thickness and is interposed between filter papers each having a diameter of 70 mm and kept under a load of 1 kg at 70° C. for 1 week, a bleed-out amount of a liquid component is 30 mg or less.