Abstract: A parallel optical switching apparatus wherein at least one m-channel light emission element array and one n-channel light receiving element array are optically connected via an m.times.n optical conversion element array and the optical conversion element array has an optical amplification function by inductive discharge of input light for each element and performs optical arithmetic or optical conversion in parallel for input light from the light emission element array by the amplification and modulation function.

Abstract: A semiconductor laser device utilizing at least a pair of semiconductor laser chips; and a fixing device for fixing the semiconductor laser chips so that electrode surfaces are approximately parallel and opposite to each other and the interval between light emitting spots of the semiconductor laser chips is small.

Abstract: A method for fabricating a composite structure, in which an intermediate member is sandwiched between first and second members, is disclosed. In this method, the intermediate member is disposed along the periphery of a spatial region formed between facing surfaces of the first and second members so that the spatial region is enclosed by the intermediate member, the fluidity of the intermediate member is enhanced under an atmosphere having a predetermined pressure, and then the pressure of the atmosphere is increased to make the intermediate member flow into the spatial region.

Abstract: Disclosed are an optical coupling device including an optical device, an optical fiber, and a guide, and a method for their production. The guide has a through-hole whose diameter is smaller than the outer diameter of the optical fiber. The through-hole is optical-axis aligned with the optical device. An end of the optical fiber is processed in such a manner that its diameter is decreased, and is fitted into the through-hole so as to optically couple the optical fiber to the optical device.

Abstract: This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.

Abstract: A mount for a light emitting device, which includes a first silicon substrate provided with first holding grooves of trapezoidal cross-section for mounting optical parts arranged in the vicinity of the light emitting plane of a light emitting element and a positioning groove for the light emitting element on the surface thereof, a second silicon substrate provided with second holding grooves having a trapezoidal cross-section similar to that of the first grooves for holding the optical parts and a hole portion for inserting the light emitting element, and a covering member for air tightly covering the hole portion, whereby the optical parts and the light emitting element of the light emitting device are tightly sealed by the above-stated means. The first and second holding grooves have the silicon crystal plane of (111) as both the side surfaces of their trapezoidal cross sections, and extend in the silicon crystal orientation of <110>.