Abstract: A substrate transporting apparatus includes a wafer transfer arm 10 for carrying a plurality of semiconductor wafers W being processed horizontally, a pitch changer 20 for carrying the wafers W at predetermined intervals vertically and a posture changing device 30 positioned between the wafer transfer arm 10 and the pitch changer 20, for changing the posture of the wafers W to the horizontal and vertical arrangements. The pitch changer 20 includes a first holding part 21A and a second holding part 21B which are adapted so as to elevate relatively to each other. The wafers W are held by either one of the holding parts 21A, 21B at the predetermined intervals. The posture changing device 30 has a pair of holders 31 between which the semiconductor wafers W is interposed. The holders 31 are respectively provided, on their sides opposing each other, with a plurality of holding grooves 32A, 32B for retaining the wafers W independently.

Abstract: A substrate transporting apparatus includes a wafer transfer arm 10 for carrying a plurality of semiconductor wafers W being processed horizontally, a pitch changer 20 for carrying the wafers W at predetermined intervals vertically and a posture changing device 30 positioned between the wafer transfer arm 10 and the pitch changer 20, for changing the posture of the wafers W to the horizontal and vertical arrangements. The pitch changer 20 includes a first holding part 21A and a second holding part 21B which are adapted so as to elevate relatively to each other. The wafers W are held by either one of the holding parts 21A, 21B at the predetermined intervals. The posture changing device 30 has a pair of holders 31 between which the semiconductor wafers W is interposed. The holders 31 are respectively provided, on their sides opposing each other, with a plurality of holding grooves 32A, 32B for retaining the wafers W independently.

Abstract: A principal part of an attitude control system comprises: holding means 30 for holding wafers W so that the wafers W are rotatable in circumferential directions; rotation transmitting means 40 for contacting a peripheral portion of each of the wafers W to rotate the wafers W; a stepping motor 50 for rotating the wafers W; transmission switching means 60 for selectively transmitting a power from the stepping motor 50 to the rotation transmitting means 40; a photo sensor 70 for detecting a notch Wa formed in the peripheral portion of each of the wafers W; and a CPU 80 for controlling the operations of the stepping motor 50 and the transmission switching means 60 on the basis of a detection signal outputted from the photo sensor 70. Thus, the notch Wa of each of the rotating wafers W is detected, and the stepping motor 50 and the transmission switching means 60 are controlled on the basis of the detection signal, so that it is possible to carry out the positioning of the wafers W.

Abstract: This invention relates to a device for simultaneously centering a plurality of substrates, particularly semiconductor wafers W.A plurality of turntables 23 for supporting the semiconductor wafers W are arranged at a predetermined spacing in the vertical direction. All of the turntables 23 are driven by a single, common servo motor 28. Clutches 26 for each of the turntables 23 are disposed on rotational shafts 38a and 38b that are driven by the servo motor 28. A drive pulley 41 is attached to an output side of each clutch 26 and each drive pulley 41 drives the corresponding turntable 23 via a belt. A sensor device 29 for detecting a notch formed in the peripheral edge of each semiconductor wafer W is disposed on an outer side in the radial direction of each of the turntables 23.A wafer W is placed on each of the turntables 23 and is centered. The servo motor 28 operates in a state in which the clutches 26 are connected, so that all of the turntables 23 start to rotate simultaneously.