Abstract: A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first plate-like base substrate has a base electrode on the rear surface thereof. A second plate-like base substrate is connected to the primary surface of the first plate-like base substrate, and the second plate-like base substrate has a substantially same extrapolated outer shape in a plane parallel to the primary surface of the first plate-like base substrate. The second plate-like base substrate has a penetrating hole perpendicular to the primary surface of the first plate-like base substrate. A plate-like cap member is connected to the second plate-like base substrate to cover the penetrating hole in the second plate-like base substrate.

Abstract: Semiconductor chips are housed in respective cavities formed in a plate-like base substrate, and plate-like cap members are bonded onto the base substrate. The base substrate is diced to thereby form a plurality of semiconductor packages. Penetrating holes are formed in the base substrate between the cavities. The base substrate and the cap members are formed from alumina material of low purity or organic material. The hollow package structure prevents a deterioration in a high-frequency characteristic, and attains high productivity.

Abstract: A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first plate-like base substrate has a base electrode on the rear surface thereof. A second plate-like base substrate is connected to the primary surface of the first plate-like base substrate, and the second plate-like base substrate has a substantially same extrapolated outer shape in a plane parallel to the primary surface of the first plate-like base substrate. The second plate-like base substrate has a penetrating hole perpendicular to the primary surface of the first plate-like base substrate. A plate-like cap member is connected to the second plate-like base substrate to cover the penetrating hole in the second plate-like base substrate.

Abstract: In a semiconductor package for radio frequency, slits arranged like dotted lines, elongated metallic plates, or rectangular dielectric members are provided on a surface for grounding of the package, on which a semiconductor element is mounted, whereby an area for grounding positioned just below the semiconductor element and areas in the surface for grounding of the package being in contact with wires for grounding are arranged with extremely short intervals to thereby substantially reduce components of inductance causing deterioration of radio frequency properties; and disconnections of the wires in the surface for grounding caused by extrusion of a jointing material 6 are prevented.

Abstract: A semiconductor package includes a package body, a semiconductor chip disposed on the surface of the package body, external lead terminals disposed on two opposite side surfaces of the package body, a lid hermetically sealing and shielding the semiconductor chip in the package body, a package substrate having a metallized region on which the package body is mounted, and a metal layer disposed on the rear surface of the package body and connected to the metallized region of the package substrate with solder. The metal layer includes material having a good adhesion to the solder and has a pattern in which stripe-shaped metal portions abut two opposite side surfaces of the package body where the external lead terminals are absent, and stripe-shaped openings that abut the respective metal portions. Therefore, when the package body is soldered to the package substrate, unwanted flow of the melted solder is stopped at the openings in the metal layer.