Abstract: An object of the present invention is to provide a hydrogenated block copolymer having excellent flexibility, heat resistance, abrasion resistance and surface texture (no stickiness, oil bleeding etc.) and good processability, and a composition thereof. The present invention provides a hydrogenated block copolymer that has therein at least one of each of a vinyl aromatic compound polymer block A, a hydrogenated polymer block B of a random copolymer comprising a conjugated diene and a vinyl aromatic compound, and a hydrogenated polymer block C of a conjugated diene polymer having a vinyl bond content of not less than 30%, the hydrogenated block copolymer having a vinyl aromatic compound content of more than 50 wt % and less than 95 wt %, and a composition containing the hydrogenated block copolymer.

Abstract: An object of the present invention is to provide a hydrogenated block copolymer having excellent flexibility, heat resistance, abrasion resistance and surface texture (no stickiness, oil bleeding etc.) and good processability, and a composition thereof. The present invention provides a hydrogenated block copolymer that has therein at least one of each of a vinyl aromatic compound polymer block A, a hydrogenated polymer block B of a random copolymer comprising a conjugated diene and a vinyl aromatic compound, and a hydrogenated polymer block C of a conjugated diene polymer having a vinyl bond content of not less than 30%, the hydrogenated block copolymer having a vinyl aromatic compound content of more than 50 wt % and less than 95 wt %, and a composition containing the hydrogenated block copolymer.

Abstract: A semiconductor device includes a Si substrate, a compound semiconductor layer selectively formed on one main surface of the Si substrate, a hole formed in the Si substrate to expose a portion of a back surface of the compound semiconductor layer, a microwave monolithic integrated circuit formed on a portion of an upper surface of the compound semiconductor layer just above the exposed portion of the back surface, and a metal layer covering the back surface of the Si substrate, the side walls of the hole and the exposed portion of the back surface of the compound semiconductor layer. A Si device may be formed on the portion of the upper surface of the Si substrate where the compound semiconductor layer is not formed. GaAs may be used for the compound semiconductor layer and the metal layer is connected to the ground line.

Abstract: A registration mark to be used for a micro-fine working technique such as LSI's includes a smaller protrusion pattern within a larger recess pattern formed in a surface of the semiconductor substrate. The recess and protrusion patterns are used for coarse and fine positioning, respectively. The protrusion pattern implements precise positioning because it is isolated from other regions.

Abstract: A process for producing a graft-polymer comprises adding an aqueous solution of a salt of a strong acid and a monovalent strong base, which solution has been adjusted to a pH value of 8 to 13, to a rubber latex containing diene rubber particles and a fatty acid soap as an emulsifying agent to coagulate the above mentioned rubber particles, and thereafter adding a vinyl monomer to the latex containing the coagulated rubber particles to graft-polymerize the vinyl monomer.According to this process, the formation of rubber masses and macroparticles during the coagulation is reduced and a rubber latex containing rubber particles having a narrow range of particle size distribution is obtained. When a graft-copolymer obtained by using the latex is blended with thermoplastic resins such as vinyl chloride resins, the impact resistance of the thermoplastic resins can be remarkably improved without impairing their transparency and gloss.

Abstract: A submersible body warmer apparatus adapted to use on a diver's body and comprising a heat radiating casing body in which a self-contained fuel is combusted with air or oxygen from a source from within or without the casing body. The casing body includes a passage through which air thereby heated passes to an exhaust opening while heat is radiated from the casing body to warm a diver's body.

Abstract: A humidifer for aqualung equipment comprises a source vessel housing moistening water which is or is not contained in a fibrous material member, and a water applying passage disposed to communicate the source vessel with the gas supply passage of the respirator and normally shutting off such communication, whereby when pressure in the gas supply passage is temporarily lower than that in the source vessel upon respiration of the user, such pressure difference may cause the water in the source vessel to be applied in a sprayed form from the applying passage into the gas supply passage. A further humidifier includes a water containing fibrous material member disposed directly in the gas supply passage of the respirator and kept to be in a water containing condition by supplying water through the aforementioned water applying passage.