Patents by Inventor Katuo Sugawara

Katuo Sugawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5416373
    Abstract: Electrically insulated coils having excellent moisture resistance or water resistance utilize a simple material that is readily available. Using a simple method of manufacture, rotating electric machines such as motors for driving pumps, traction motors for rolling stocks and the like suitable for use in the outdoors may be built with the electrically insulated coils. The coils are coated with a fluorine-containing coating at least on portions which are exposed out of the side of the core. Since a uniform hydrophobic layer utilizing the repellent action of fluorine atoms is capable of being provided on the surface of the electrically insulated coils, the electrically insulated coils and the rotating electrical machines incorporating them feature excellent moisture resistance and water resistance.
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: May 16, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Syoichi Maruyama, Mitsuo Mashiko, Toru Koyama, Katuo Sugawara, Kenji Mishima, Shinichi Yamashiro
  • Patent number: 5215842
    Abstract: A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.
    Type: Grant
    Filed: January 8, 1991
    Date of Patent: June 1, 1993
    Assignees: Hitachi, Ltd., Hitachi Chemical Co., Ltd.
    Inventors: Sukekazu Aratani, Shigeo Suzuki, Akira Hosoya, Katuo Sugawara, Toshiro Saito, Tsuneaki Kawanishi, Noriyuki Kinjo, Yasuo Katsuya, Akira Kageyama
  • Patent number: 5212244
    Abstract: The present invention provide a thermosetting resin composition comprising(a) a poly-p-hydroxstyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and from more than denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
    Type: Grant
    Filed: October 8, 1991
    Date of Patent: May 18, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Junichi Katagiri, Akira Nagai, Masahiro Ono, Toshikazu Narahara
  • Patent number: 5080965
    Abstract: The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
    Type: Grant
    Filed: March 26, 1990
    Date of Patent: January 14, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Junichi Katagiri, Akira Nagai, Masahiro Ono, Toshikazu Narahara
  • Patent number: 5065285
    Abstract: The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.
    Type: Grant
    Filed: March 7, 1990
    Date of Patent: November 12, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Akira Nagai, Katuo Sugawara, Masahiro Suzuki, Junichi Katagiri, Akio Takahashi
  • Patent number: 5041478
    Abstract: A resin composition for printed circuit board and the printed circuit board in which said resin composition is used as substrate, said resin composition comprising one or more cyclic phosphonitrile compounds represented by the general formula [I] and/or [II] and an aromatic maleimide compound and/or an aromatic amine: ##STR1## wherein at least two of R's (R.sub.1 to R.sub.
    Type: Grant
    Filed: June 6, 1990
    Date of Patent: August 20, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Masahiro Ono, Toshikazu Narahara
  • Patent number: 4946734
    Abstract: A resin composition for printed circuit board and the printed circuit board in which said resin composition is used as substrate, said resin composition comprising one or more cyclic phosphonitrile compounds represented by the general formula [I] and/or [II] and an aromatic maleimide compound and/or an aromatic amine: ##STR1## wherein at least two of R's (R.sub.1 to R.sub.
    Type: Grant
    Filed: November 18, 1987
    Date of Patent: August 7, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Masahiro Ono, Toshikazu Narahara
  • Patent number: 4931507
    Abstract: The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
    Type: Grant
    Filed: November 2, 1988
    Date of Patent: June 5, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Junichi Katagiri, Akira Nagai, Masahiro Ono, Toshikazu Narahara
  • Patent number: 4809058
    Abstract: An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: February 28, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Ryoichi Kajiwara, Mituo Katou, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi, Kazuya Takahashi, Masatoshi Watanabe, Minoru Yamada, Keiichirou Nakanishi, Katuo Sugawara
  • Patent number: 4784917
    Abstract: A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.
    Type: Grant
    Filed: April 22, 1986
    Date of Patent: November 15, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Keiko Tawara, Akira Nagai, Akio Takahashi, Katuo Sugawara, Masahiro Ono, Ritsuro Tada, Motoyo Wajima, Toshikazu Narahara
  • Patent number: 4738900
    Abstract: Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.
    Type: Grant
    Filed: April 23, 1986
    Date of Patent: April 19, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Masahiro Ono, Akio Takahashi, Katuo Sugawara, Ritsuro Tada, Akira Nagai, Motoyo Wajima, Toshikazu Narahara
  • Patent number: 4710854
    Abstract: A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).
    Type: Grant
    Filed: March 10, 1987
    Date of Patent: December 1, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Minoru Yamada, Motoyo Wajima, Akira Masaki, Akio Takahashi, Keiichirou Nakanishi, Katuo Sugawara
  • Patent number: 4607094
    Abstract: The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.
    Type: Grant
    Filed: February 1, 1985
    Date of Patent: August 19, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Masahiro Ono, Ritsuro Tada, Motoyo Wajima, Toshikazu Narahara, Akira Nagai
  • Patent number: 4587162
    Abstract: A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.
    Type: Grant
    Filed: July 12, 1985
    Date of Patent: May 6, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Akira Nagai, Akio Takahashi, Katuo Sugawara, Masahiro Ono, Ritsuro Tada, Motoyo Wajima, Toshikazu Narahara
  • Patent number: 4502320
    Abstract: Method and apparatus for diagnosing abnormality of an oil-filled electric apparatus is disclosed. Presence or absence of abnormality is determined by comparing contents of plural predetermined components contained in gas extracted from the oil of the electric apparatus with respective predetermined reference values. The type of abnormality is determined on the basis of at least one set of two specific components selected from the plural components.
    Type: Grant
    Filed: July 20, 1982
    Date of Patent: March 5, 1985
    Assignees: Hitachi, Ltd., Shikoku Electric Power Company, Inc.
    Inventors: Seiichi Sakai, Toshihiko Gange, Hideo Tsukioka, Katuo Sugawara, Ichitaro Tani, Etsunori Mori, Shigeo Shiono
  • Patent number: 4470832
    Abstract: A gas chromatographic apparatus having at least two gas separation columns arranged in parallel to each other, the outlet of the first gas separation column being connected to a gas sensor through a column switch valve, and the outlet of the second gas separation column being connected to the column switch valve through a gas detection time-controlling pipe, where when the first gas separation column is communicated with the gas sensor, the outlet of the second gas separation column is made open to the atmosphere by the column switch valve, or when the second gas separation column is communicated with the gas sensor, the outlet of the first gas separation column is made open to the atmosphere by the column switch valve, or the apparatus having a first gas separation column whose inlet is connected to the switch valve and at least two second columns whose inlets are connected to the outlet of the first gas separation column, whose outlets are connected to the gas sensor and which are arranged in parallel to ea
    Type: Grant
    Filed: March 9, 1983
    Date of Patent: September 11, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Ictitaro Tani, Hideo Tsukioka, Etsuo Ohe, Etsunori Mori
  • Patent number: 4444040
    Abstract: In an apparatus for detecting gas components in the oil in an oil-filled device, which comprises a gas-storing chamber being provided at an oil-filled device containing an insulating oil through a gas-permeating material capable of separating gas components from the insulating oil, a gas calibration tube being provided at the gas-storing chamber through a switch valve, and a gas chromatographic device connected to the gas calibration tube through the switch valve, any influence of gas components in a subatmospheric pressure is eliminated and exact concentrations of gas components are detected by providing at least one stirring mixer having at least one throttle perforation in a carrier gas passage for supplying the gas components from the gas calibration tube to the gas chromatographic device at the upstream side of a gas separation column of the gas chromatographic device, or by proving a circulation passage between the gas-storing chamber and the gas calibration tube, a valve capable of being exposed to the
    Type: Grant
    Filed: July 20, 1982
    Date of Patent: April 24, 1984
    Assignees: Hitachi, Ltd., Shikoku Electric Power Company, Inc.
    Inventors: Seiichi Sakai, Toshihiko Gange, Katuo Sugawara, Hideo Tsukioka, Ictitaro Tani, Shigeo Shiono, Etsunori Mori
  • Patent number: 4402211
    Abstract: A system for monitoring an abnormality of an oil-filled electric device by detecting the components of the gas dissolved in the insulating oil. A gas-in-oil separator which separates the gas from the insulating oil, a gas reservoir where the separated gas is collected, an air feeder which supplies air for delivering out the gas in said gas reservoir, a separating column packed with a gas separating filler whereby the gas supplied from the gas reservoir is separated into the components, a combustible gas detector element disposed in a case which connects at its one end to the outlet of said separating column, and a change-over valve disposed at a location connecting said gas reservoir, are provided. The air feeder and said separating column are adapted to switch a route passing the air from the air feeder into the separating column along with the gas via the gas reservoir to or from a route passing the air directly into the separating column.
    Type: Grant
    Filed: May 20, 1981
    Date of Patent: September 6, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Etsuo Ohe, Ichitaro Tani, Hideo Tsukioka
  • Patent number: 4070416
    Abstract: A novel thermosetting resin can be obtained by mixing 1 equivalent or more of a polyfunctional isocyanate per 1 equivalent of a polyfunctional epoxide and then carrying out a polymerization reaction of the mixture in the presence of the catalyst which forms isocyanurate rings and oxazolidone rings so as to enable the mixture to form 2 or more isocyanurate rings directly connected with oxazolidone rings through an isocyanate residues.The resulting thermosetting resin has excellent electrical, chemical and impact resistances and excellent self-extinguishing properties. Said resin is used as an electric insulating material.
    Type: Grant
    Filed: August 18, 1975
    Date of Patent: January 24, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Toshikazu Narahara, Katuo Sugawara, Yoshiharu Karasawa, Hitoshi Yokono, Junji Mukai, Tadashi Muroi