Abstract: An insulating package is provided with an insulating base having a bottom plate and frame body, electrodes led from the inside to the outside of the insulating base, and a metal cap to seal the frame body. The metal cap is adhered to the frame body by low melting point glass. This low melting point glass contains at least one selected from a group consisting of Al, Ni, Ag, BaTiO3, NiCr, TiB, and TiO2, and inside the glass, spherical particles with diameters of 10 &mgr;m or more are dispersed.

Abstract: A ceramic package type electronic part for accommodating an electronic device includes a ceramic package body, an electrode, and a conductive adhesive. The electrode is disposed for the ceramic package body and is to be bonded to the electronic device. The conductive adhesive bonds the electronic device and the electrode to each other. The conductive adhesive is provided to be extended to a specific surface portion of a surface portion of the ceramic package body, from a bonding portion of the electronic device and the electrode.

Abstract: A glass-ceramic composite which has forsterite in an amount of 40 to 60% by weight is included in crystallized glass having a coefficient of thermal expansion of 100.degree. to 200.times.10.sup.-7 /.degree.C. is used to configure a package, to the electrode pads of which a quartz crystal is directly soldered, without any supporting material. A quartz crystal piece is included within a flat package that use a glass-ceramic composite according to the present invention, thereby greatly limiting the variation in resonance characteristics with respect to heat treating done when the package is sealed, as compared to previous packages.