Abstract: A hybrid integrated circuit for high output power having a conductive pattern on a ceramic substrate, a lead frame connected to said pattern, and electronic components mounted on said pattern wired with one another, has been found. When said conductive pattern has an inductor in a spiral shape, the same spiral pattern is conformed on the lead frame, and those two spiral patterns are overlapped. Thus, the resistance of the inductor is reduced since the conductive pattern and the lead frame pattern are connected parallel to each other. Then, a large current can be loaded to said inductance with only a small loss. As the material of the lead frame is cheap, the resultant hybrid integrated circuit can be manufactured at a lower cost.