Patents by Inventor Kaun-Chang Wu

Kaun-Chang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature measuring board device and temperature measuring board thereof
    Patent number: 9810582
    Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: November 7, 2017
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Hsin-Lun Tsai, Kaun-Chang Wu
  • TEMPERATURE MEASURING BOARD DEVICE AND TEMPERATURE MEASURING BOARD THEREOF
    Publication number: 20150323393
    Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.
    Type: Application
    Filed: October 8, 2014
    Publication date: November 12, 2015
    Inventors: Hao-Chun Hsieh, Hsin-Lun Tsai, Kaun-Chang Wu