Patents by Inventor Kaung-Wu Nieh

Kaung-Wu Nieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP SLURRY DELIVERY SYSTEM AND METHOD OF MIXING SLURRY THEREOF
    Publication number: 20070060028
    Abstract: A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying a corrosion inhibitor, and a fourth slurry supply reservoir for supplying an oxidizer.
    Type: Application
    Filed: October 30, 2006
    Publication date: March 15, 2007
    Inventors: Sheng-Yu Chen, Te-Sung Hung, Chi-Piao Cheng, Chung-Jung Cheng, Kaung-Wu Nieh, Po-Yuan Cheng, Jiann-Fu Chen, Chun-Ting Hu, Tzu-Yu Tseng, Tzu-Yi Hsieh, Hung-Chi Pai, Yung-Chieh Kuo
  • CMP SLURRY DELIVERY SYSTEM AND METHOD OF MIXING SLURRY THEREOF
    Publication number: 20060191871
    Abstract: A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying a corrosion inhibitor, and a fourth slurry supply reservoir for supplying an oxidizer.
    Type: Application
    Filed: February 25, 2005
    Publication date: August 31, 2006
    Inventors: Sheng-Yu Chen, Te-Sung Hung, Chi-Piao Cheng, Chung-Jung Cheng, Kaung-Wu Nieh, Po-Yuan Cheng, Jiann-Fu Chen, Chun-Ting Hu, Tzu-Yu Tseng, Tzu-Yi Hsieh, Hung-Chi Pai, Yung-Chieh Kuo