Patents by Inventor Kaushik ROYCHOWDHURY

Kaushik ROYCHOWDHURY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11853251
    Abstract: Disclosed are techniques for chip-to-chip (C2C) serial communications, such as communications between chiplets on a multi-chip package. In some aspects, a method of on-die monitoring of C2C links comprises detecting a change of the C2C link from a first link state to a second link state and storing link state change information in an on-die first-in, first-out (FIFO) buffer. The link state change information indicates the first link state, the duration of time the C2C link was in the first link state, and the speed of the C2C link in the first link state. Upon detecting a request for link state change information, link state change information is retrieved from the FIFO buffer and transmitted serially to an output pin of the die, such as a general purpose input/output (GPIO) pin.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: December 26, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Ramesh Krishnamurthy Madhira, Ibrahim Ouda, Kaushik Roychowdhury
  • Publication number: 20230359579
    Abstract: Disclosed are techniques for chip-to-chip (C2C) serial communications, such as communications between chiplets on a multi-chip package. In some aspects, a method of on-die monitoring of C2C links comprises detecting a change of the C2C link from a first link state to a second link state and storing link state change information in an on-die first-in, first-out (FIFO) buffer. The link state change information indicates the first link state, the duration of time the C2C link was in the first link state, and the speed of the C2C link in the first link state. Upon detecting a request for link state change information, link state change information is retrieved from the FIFO buffer and transmitted serially to an output pin of the die, such as a general purpose input/output (GPIO) pin.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 9, 2023
    Inventors: Ramesh Krishnamurthy MADHIRA, Ibrahim OUDA, Kaushik ROYCHOWDHURY