Patents by Inventor Kaustubh Shrimali

Kaustubh Shrimali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated assemblies and methods of forming integrated assemblies
    Patent number: 11848360
    Abstract: Some embodiments include an integrated assembly containing a first structure which includes one or more transition metals, and containing a second structure over the first structure. The second structure has a first region directly against the first structure and has a second region spaced from the first structure by a gap region. The second structure includes semiconductor material having at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Groups 15 and 16 of the periodic table. An ionic compound is within the gap region. Some embodiments include a method of forming an integrated assembly.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: December 19, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yoshitaka Nakamura, Devesh Dadhich Shreeram, Yi Fang Lee, Scott E. Sills, Jerome A. Imonigie, Kaustubh Shrimali
  • Integrated Assemblies and Methods of Forming Integrated Assemblies
    Publication number: 20220406899
    Abstract: Some embodiments include an integrated assembly containing a first structure which includes one or more transition metals, and containing a second structure over the first structure. The second structure has a first region directly against the first structure and has a second region spaced from the first structure by a gap region. The second structure includes semiconductor material having at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Groups 15 and 16 of the periodic table. An ionic compound is within the gap region. Some embodiments include a method of forming an integrated assembly.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Applicant: Micron Technology, Inc.
    Inventors: Yoshitaka Nakamura, Devesh Dadhich Shreeram, Yi Fang Lee, Scott E. Sills, Jerome A. Imonigie, Kaustubh Shrimali