Patents by Inventor Kavitha Bharadwaj
Kavitha Bharadwaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11908594Abstract: The present disclosure describes an electrical cable accessory system for covering an electrical cable and/or cable connection. The electrical cable accessory system includes a pre-expanded cable accessory unit and a time-temperature indicator associated with the pre-expanded cable accessory unit. The pre-expanded cable accessory unit includes a pre-expanded cable accessory formed of an elastomeric material and a removable holdout mounted within the elastomeric cable accessory, wherein the holdout is operative to maintain the elastomeric cable accessory in an expanded state and to permit the elastomeric cable accessory to elastically contract when the holdout is removed from the elastomeric cable accessory. The time-temperature indicator is configured to undergo a visible change in appearance in response to a cumulative heat exposure and signal to a viewer when the elastomeric material of the pre-expanded elastomeric cable accessory unit has experienced a threshold cumulative heat exposure.Type: GrantFiled: August 12, 2021Date of Patent: February 20, 2024Assignee: TE CONNECTIVITY SOLUTIONS GMBHInventors: Harry George Yaworski, Kavitha Bharadwaj
-
Patent number: 11843232Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.Type: GrantFiled: December 20, 2021Date of Patent: December 12, 2023Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin Francis Polosky, Henry Paul S. Cervantes
-
Patent number: 11670437Abstract: A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.Type: GrantFiled: January 12, 2022Date of Patent: June 6, 2023Assignee: TE Connectivity Solutions GmbHInventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Publication number: 20220139597Abstract: A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.Type: ApplicationFiled: January 12, 2022Publication date: May 5, 2022Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
-
Publication number: 20220115848Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.Type: ApplicationFiled: December 20, 2021Publication date: April 14, 2022Inventors: Vijay DAGA, Jaydip DAS, Kavitha BHARADWAJ, Ting GAO, Quentin Francis POLOSKY, Henry Paul S. CERVANTES
-
Publication number: 20220059259Abstract: The present disclosure describes an electrical cable accessory system for covering an electrical cable and/or cable connection. The electrical cable accessory system includes a pre-expanded cable accessory unit and a time-temperature indicator associated with the pre-expanded cable accessory unit. The pre-expanded cable accessory unit includes a pre-expanded cable accessory formed of an elastomeric material and a removable holdout mounted within the elastomeric cable accessory, wherein the holdout is operative to maintain the elastomeric cable accessory in an expanded state and to permit the elastomeric cable accessory to elastically contract when the holdout is removed from the elastomeric cable accessory. The time-temperature indicator is configured to undergo a visible change in appearance in response to a cumulative heat exposure and signal to a viewer when the elastomeric material of the pre-expanded elastomeric cable accessory unit has experienced a threshold cumulative heat exposure.Type: ApplicationFiled: August 12, 2021Publication date: February 24, 2022Inventors: Harry George Yaworski, Kavitha Bharadwaj
-
Patent number: 11257612Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.Type: GrantFiled: July 26, 2018Date of Patent: February 22, 2022Assignee: TE Connectivity Services GMBHInventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Patent number: 11239639Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.Type: GrantFiled: September 30, 2016Date of Patent: February 1, 2022Assignee: TE Connectivity Services GMBHInventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
-
Publication number: 20200035383Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.Type: ApplicationFiled: July 26, 2018Publication date: January 30, 2020Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Patent number: 10483661Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.Type: GrantFiled: July 17, 2018Date of Patent: November 19, 2019Assignee: TE CONNECTIVITY CORPORATIONInventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Patent number: 10297946Abstract: An electrical connection sealer includes an outer jacket and a low-viscosity sealant. The outer jacket includes a first piece of heat-shrinkable tubing. The outer jacket has a pre-sealed end and an open end opposite the pre-sealed end. The first piece of heat-shrinkable tubing at the open end is heat-recoverable and forms a cavity for insertion of an electrical connection. The low-viscosity sealant is insertable into the cavity. Upon application of heat to the electrical connection sealer with the electrical connection and the low-viscosity sealant in the cavity of the electrical connection sealer, the low-viscosity sealant flows across and through the first wires and the at least one second wire and the first piece of heat-shrinkable tubing shrinks to encapsulate the electrical connection and seal the electrical connection and the low-viscosity sealant substantially within the outer jacket.Type: GrantFiled: April 19, 2018Date of Patent: May 21, 2019Assignee: TE CONNECTIVITY CORPORATIONInventors: Vijay Daga, Kavitha Bharadwaj, Sunny Sethi, Ting Gao
-
Publication number: 20180323519Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.Type: ApplicationFiled: July 17, 2018Publication date: November 8, 2018Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
-
Patent number: 10109947Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.Type: GrantFiled: February 7, 2017Date of Patent: October 23, 2018Assignee: TE CONNECTIVITY CORPORATIONInventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Patent number: 10103458Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.Type: GrantFiled: April 21, 2017Date of Patent: October 16, 2018Assignee: TE CONNECTIVITY CORPORATIONInventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
-
Publication number: 20180226731Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.Type: ApplicationFiled: April 21, 2017Publication date: August 9, 2018Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
-
Publication number: 20180226742Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.Type: ApplicationFiled: February 7, 2017Publication date: August 9, 2018Inventors: Sunny SETHI, Vijay DAGA, Kavitha Bharadwaj, Ting GAO
-
Publication number: 20180097344Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.Type: ApplicationFiled: September 30, 2016Publication date: April 5, 2018Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
-
Publication number: 20170145170Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.Type: ApplicationFiled: February 6, 2017Publication date: May 25, 2017Applicant: TE Connectivity CorporationInventors: Jaydip Das, Ting Gao, Mark F. Wartenberg, Kavitha Bharadwaj, Richard B. Lloyd, Rodney Ivan Martens
-
Patent number: 9646746Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.Type: GrantFiled: July 10, 2015Date of Patent: May 9, 2017Assignee: ITTELFUSE, INC.Inventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
-
Publication number: 20170004946Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Applicant: Tyco Electronics CorporationInventors: Edward W. Rutter, JR., Ann O. Banich, Jaydip Das, Chun-Kwan Tsang, Kavitha Bharadwaj, Ting Gao, Jianhua Chen, James Toth