Patents by Inventor Kavitha Bharadwaj

Kavitha Bharadwaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11908594
    Abstract: The present disclosure describes an electrical cable accessory system for covering an electrical cable and/or cable connection. The electrical cable accessory system includes a pre-expanded cable accessory unit and a time-temperature indicator associated with the pre-expanded cable accessory unit. The pre-expanded cable accessory unit includes a pre-expanded cable accessory formed of an elastomeric material and a removable holdout mounted within the elastomeric cable accessory, wherein the holdout is operative to maintain the elastomeric cable accessory in an expanded state and to permit the elastomeric cable accessory to elastically contract when the holdout is removed from the elastomeric cable accessory. The time-temperature indicator is configured to undergo a visible change in appearance in response to a cumulative heat exposure and signal to a viewer when the elastomeric material of the pre-expanded elastomeric cable accessory unit has experienced a threshold cumulative heat exposure.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: February 20, 2024
    Assignee: TE CONNECTIVITY SOLUTIONS GMBH
    Inventors: Harry George Yaworski, Kavitha Bharadwaj
  • Patent number: 11843232
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: December 12, 2023
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin Francis Polosky, Henry Paul S. Cervantes
  • Patent number: 11670437
    Abstract: A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: June 6, 2023
    Assignee: TE Connectivity Solutions GmbH
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Publication number: 20220139597
    Abstract: A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 5, 2022
    Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
  • Publication number: 20220115848
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: Vijay DAGA, Jaydip DAS, Kavitha BHARADWAJ, Ting GAO, Quentin Francis POLOSKY, Henry Paul S. CERVANTES
  • Publication number: 20220059259
    Abstract: The present disclosure describes an electrical cable accessory system for covering an electrical cable and/or cable connection. The electrical cable accessory system includes a pre-expanded cable accessory unit and a time-temperature indicator associated with the pre-expanded cable accessory unit. The pre-expanded cable accessory unit includes a pre-expanded cable accessory formed of an elastomeric material and a removable holdout mounted within the elastomeric cable accessory, wherein the holdout is operative to maintain the elastomeric cable accessory in an expanded state and to permit the elastomeric cable accessory to elastically contract when the holdout is removed from the elastomeric cable accessory. The time-temperature indicator is configured to undergo a visible change in appearance in response to a cumulative heat exposure and signal to a viewer when the elastomeric material of the pre-expanded elastomeric cable accessory unit has experienced a threshold cumulative heat exposure.
    Type: Application
    Filed: August 12, 2021
    Publication date: February 24, 2022
    Inventors: Harry George Yaworski, Kavitha Bharadwaj
  • Patent number: 11257612
    Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: February 22, 2022
    Assignee: TE Connectivity Services GMBH
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Patent number: 11239639
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 1, 2022
    Assignee: TE Connectivity Services GMBH
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
  • Publication number: 20200035383
    Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 30, 2020
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Patent number: 10483661
    Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: November 19, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Patent number: 10297946
    Abstract: An electrical connection sealer includes an outer jacket and a low-viscosity sealant. The outer jacket includes a first piece of heat-shrinkable tubing. The outer jacket has a pre-sealed end and an open end opposite the pre-sealed end. The first piece of heat-shrinkable tubing at the open end is heat-recoverable and forms a cavity for insertion of an electrical connection. The low-viscosity sealant is insertable into the cavity. Upon application of heat to the electrical connection sealer with the electrical connection and the low-viscosity sealant in the cavity of the electrical connection sealer, the low-viscosity sealant flows across and through the first wires and the at least one second wire and the first piece of heat-shrinkable tubing shrinks to encapsulate the electrical connection and seal the electrical connection and the low-viscosity sealant substantially within the outer jacket.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: May 21, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Vijay Daga, Kavitha Bharadwaj, Sunny Sethi, Ting Gao
  • Publication number: 20180323519
    Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.
    Type: Application
    Filed: July 17, 2018
    Publication date: November 8, 2018
    Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
  • Patent number: 10109947
    Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: October 23, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Patent number: 10103458
    Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: October 16, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Sunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
  • Publication number: 20180226731
    Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.
    Type: Application
    Filed: April 21, 2017
    Publication date: August 9, 2018
    Inventors: Sunny SETHI, Vijay DAGA, Kavitha BHARADWAJ, Ting GAO
  • Publication number: 20180226742
    Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 9, 2018
    Inventors: Sunny SETHI, Vijay DAGA, Kavitha Bharadwaj, Ting GAO
  • Publication number: 20180097344
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
  • Publication number: 20170145170
    Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.
    Type: Application
    Filed: February 6, 2017
    Publication date: May 25, 2017
    Applicant: TE Connectivity Corporation
    Inventors: Jaydip Das, Ting Gao, Mark F. Wartenberg, Kavitha Bharadwaj, Richard B. Lloyd, Rodney Ivan Martens
  • Patent number: 9646746
    Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 9, 2017
    Assignee: ITTELFUSE, INC.
    Inventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
  • Publication number: 20170004946
    Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.
    Type: Application
    Filed: June 30, 2015
    Publication date: January 5, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Edward W. Rutter, JR., Ann O. Banich, Jaydip Das, Chun-Kwan Tsang, Kavitha Bharadwaj, Ting Gao, Jianhua Chen, James Toth