Abstract: The present disclosure provides leadless pacemaker systems and methods. A leadless pacemaker includes a battery subassembly, a feedthrough subassembly, and an electronics subassembly coupled between the battery subassembly and the feedthrough subassembly, the electronics subassembly including an electronics package, and a housing configured to provide a hermetic seal and comprising a first retaining feature and a second retaining feature configured to secure the electronics package within the housing.

Abstract: The implantable medical device includes high-voltage components (such as defibrillation shock generation components) operative to generate high-voltage pulses for delivery to tissues of the patient while using the case or housing of the device as a stimulation electrode. The device also includes low-voltage Medical Implant Communication Service (MICS) or Medical Device Radiocommunications Service (MedRadio) components operative to generate low-power signals for communicating with an external device via radio frequencies while using the case as part of an antenna. A conductive noise shield is mounted within the case of the device and interposed between the high-voltage components and the case, with the shield configured to attenuate electrical interference between the high-voltage components and the case to facilitate radio-frequency communication between the low-voltage MICS/MedRadio components and the external device, which use the case as part of the antenna.

Abstract: A method for hermetically sealing electronic circuitry within a housing of an implantable medical device is provided. The method comprises assembling the housing having an interior cavity, joining a feed-through assembly to the housing, and joining a back-fill member to the feed-through housing. The back fill member has an opening there through communicating with the interior cavity of the housing. The housing is back-filled with an inert gas through the opening in the back-fill member, and the interior cavity is hermetically sealed by closing the opening through the back-fill member with a sealing element. The sealing element and back-fill member are formed of different first and second materials, respectively.

Abstract: In a medical implantable device having a hermetically sealed, radio shielded encapsulations containing an RF circuit therein and having an antenna located outside of the encapsulation, and in a method for connecting the RF circuit to the antenna, at least one hermetical feedthrough connection is provided in the form of at least one conductor passing through a wall portion of the encapsulation in a liquid-tight and gas-tight manner, with the feedthrough being electrically insulated from the encapsulation. At least one connector pin is provided on an RF circuit board, which is resiliently mounted on the RF circuit board. The RF circuit is mounted in the encapsulation so as to cause the connector pin to resiliently engage the conductor and to electrically connect the conductor with the RF circuit board.

Abstract: An implantable medical device and methods of manufacture are provided for implantation in a body. The device includes a device housing having an interior cavity and electronic circuitry located in the interior cavity of the device housing. The electronic circuitry detects a physiologic condition of the body and delivers a therapy to the body. The device further includes a feed-through assembly having a feed-through housing that is joined to the device housing. The feed-through assembly includes conductors held in the feed-through housing and electronically connected to the electronic circuitry. A back-fill member is joined to the feed-through housing. The back-fill member has an opening there through communicating with the interior cavity of the device housing. A sealing element is hermetically secured in the opening through the back-fill member. The sealing element and back-fill member are formed of different first and second materials, respectively.

Abstract: An implantable medical device and methods of manufacture are provided for implantation in a body. The device includes a device housing having an interior cavity and electronic circuitry located in the interior cavity of the device housing. The electronic circuitry detects a physiologic condition of the body and delivers a therapy to the body. The device further includes a feed-through assembly having a feed-through housing that is joined to the device housing. The feed-through assembly includes conductors held in the feed-through housing and electronically connected to the electronic circuitry. A back-fill member is joined to the feed-through housing. The back-fill member has an opening there through communicating with the interior cavity of the device housing. A sealing element is hermetically secured in the opening through the back-fill member. The sealing element and back-fill member are formed of different first and second materials, respectively.

Abstract: In a medical implantable device having a hermetically sealed, radio shielded encapsulations containing an RF circuit therein and having an antenna located outside of the encapsulation, and in a method for connecting the RF circuit to the antenna, at least one hermetical feedthrough connection is provided in the form of at least one conductor passing through a wall portion of the encapsulation in a liquid-tight and gas-tight manner, with the feedthrough being electrically insulated from the encapsulation. At least one connector pin is provided on an RF circuit board, which is resiliently mounted on the RF circuit board. The RF circuit is mounted in the encapsulation so as to cause the connector pin to resiliently engage the conductor and to electrically connect the conductor with the RF circuit board.

Abstract: An implantable medical device has a conductive housing containing circuitry for operation of the device and radio frequency circuitry for transmitting and/or receiving radio frequency signals. An insulating header is arranged adjacent to the conductive housing. A conductive structure is provided on a surface of, and/or within, the insulating header. An antenna feed is operatively interconnected between the radio frequency circuitry and the conductive structure. The conductive structure is galvanically connected to the conductive housing, and the conductive structure and the conductive housing, in combination, operate as a transmitting and/or receiving antenna for the radio frequency signals.

Abstract: A feedthrough apparatus for a implantable medical device having a casing includes a conductive housing having an outer side, an inner side, and a peripheral surface with a continuous assembly groove therein for mounting on the casing of the implantable medical device. The conductive housing has first and second through bores extending between the outer side and the inner side in spaced apart, generally parallel, relationship. First and second filtered feedthrough assemblies are received, respectively, in the first and second through bores. Each filtered feedthrough assembly includes an insulative terminal, a filter capacitor, and a plurality of lead wires electrically isolated from the conductive housing supported on and extending through the insulative terminal and through the filter capacitor in conductive relation therewith. Also, a backfill port is provided on the conductive housing and has a passageway extending between the inner side and the outer side.