Patents by Inventor Kaw-Wei KUO

Kaw-Wei KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP cleaning system and method
    Patent number: 10741381
    Abstract: A cleaning apparatus and a method of using the cleaning apparatus are provided. The method includes first moving a pencil pad into contact with a top surface of a wafer, wherein the pencil pad is connected to a pivot arm and second moving the pivot arm in a sweeping motion from a first zone to a second zone, the first zone being closer to a center of the top surface of the wafer than the second zone, wherein the sweeping motion is controlled by a controller, the pivot arm moves at a first speed in the first zone and the pivot arm moves at a second speed in the second zone, wherein the first speed is different from the second speed.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kaw-Wei Kuo, Chun-Hao Kung, Kuo-Feng Huang, Yi-Wei Chiu, Wei-Chun Chen
  • CMP Cleaning System and Method
    Publication number: 20180174829
    Abstract: A cleaning apparatus and a method of using the cleaning apparatus are provided. The method includes first moving a pencil pad into contact with a top surface of a wafer, wherein the pencil pad is connected to a pivot arm and second moving the pivot arm in a sweeping motion from a first zone to a second zone, the first zone being closer to a center of the top surface of the wafer than the second zone, wherein the sweeping motion is controlled by a controller, the pivot arm moves at a first speed in the first zone and the pivot arm moves at a second speed in the second zone, wherein the first speed is different from the second speed.
    Type: Application
    Filed: May 23, 2017
    Publication date: June 21, 2018
    Inventors: Kaw-Wei Kuo, Chun-Hao Kung, Kuo-Feng Huang, Yi-Wei Chiu, Wei-Chun Chen
  • Abrasive article, conditioning disk and method for forming abrasive article
    Patent number: 9144883
    Abstract: In accordance with some embodiments, an abrasive article is provided. The abrasive article includes a carrier. The abrasive article further includes a matrix layer on the carrier. The matrix layer includes a copper-titanium-tin alloy, wherein the copper-titanium-tin alloy includes from about 70 wt % to about 90 wt % of copper, from about 5 wt % to about 15 wt % of titanium, and from about 5 wt % to about 15 wt % of tin. The abrasive article also includes at least one abrasive particle partially embedded in the matrix layer. The abrasive particle includes carbon.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: September 29, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Po-Chun Huang, Yen-Chang Chao, Kaw-Wei Kuo
  • ABRASIVE ARTICLE, CONDITIONING DISK AND METHOD FOR FORMING ABRASIVE ARTICLE
    Publication number: 20150224624
    Abstract: In accordance with some embodiments, an abrasive article is provided. The abrasive article includes a carrier. The abrasive article further includes a matrix layer on the carrier. The matrix layer includes a copper-titanium-tin alloy, wherein the copper-titanium-tin alloy includes from about 70 wt % to about 90 wt % of copper, from about 5 wt % to about 15 wt % of titanium, and from about 5 wt % to about 15 wt % of tin. The abrasive article also includes at least one abrasive particle partially embedded in the matrix layer. The abrasive particle includes carbon.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Po-Chun HUANG, Yen-Chang CHAO, Kaw-Wei KUO