Patents by Inventor Kawasumi Yoshio

Kawasumi Yoshio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treating process for copper foil for use in printed circuit
    Patent number: 4131517
    Abstract: A surface treating process for a copper foil for use in a printed circuit, in which the surface of a copper foil is subjected to a cathodic treatment in an electrolytic bath of an aqueous solution of sulfuric acid, containing nickel and copper ions, with the copper foil being used as a cathode.The copper foil thus subjected to cathodic treatment is brought into contact with an aqueous solution containing one of sodium hexametaphosphate .alpha.-nitroso R salt, 2-mercaptobenzothiazole, rubeanic acid, anthranilic acid, benzenesulfonamide, phthalic acid, potassium dichromate.
    Type: Grant
    Filed: June 3, 1977
    Date of Patent: December 26, 1978
    Assignee: Nippon Mining Co., Ltd.
    Inventors: Takahashi Mitsuo, Kawasumi Yoshio