Patents by Inventor Kawori Kishi

Kawori Kishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a speaker
    Patent number: 7685695
    Abstract: A method of producing a speaker which is manufactured by bonding a plurality of speaker components, including steps of humidifying a joint portion which bonds at least two speaker components among the plurality of speaker components; and bonding the speaker components by humidifying the joint portion and thereafter painting a moisture-curable adhesive on the joint portion, to thereby reduce a time for bonding the speaker components by easily and quickly drying regardless of materials of the speaker components.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: March 30, 2010
    Assignees: Pioneer Corporation, Tohoku Pioneer Corporation
    Inventor: Kawori Kishi
  • Method of producing a speaker
    Publication number: 20070289120
    Abstract: A method of producing a speaker which is manufactured by bonding a plurality of speaker components, including steps of humidifying a joint portion which bonds at least two speaker components among the plurality of speaker components; and bonding the speaker components by humidifying the joint portion and thereafter painting a moisture-curable adhesive on the joint portion, to thereby reduce a time for bonding the speaker components by easily and quickly drying regardless of materials of the speaker components.
    Type: Application
    Filed: May 25, 2007
    Publication date: December 20, 2007
    Inventor: Kawori Kishi
  • Speaker device
    Publication number: 20070047754
    Abstract: A speaker device includes a diaphragm and a voice coil including plus and minus lead wires. In this speaker device, as a measure of fixing (reinforcing) each of the plus and minus lead wires, a solventless adhesive is used. Each of the plus and minus lead wires is fixed (reinforced) onto a sound output surface of the diaphragm by the solventless adhesive.
    Type: Application
    Filed: August 31, 2006
    Publication date: March 1, 2007
    Inventor: Kawori Kishi