Patents by Inventor Kay Essig

Kay Essig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe package structure and manufacturing method thereof
    Patent number: 8309400
    Abstract: The package structure includes a metal sheet having a first central block, a plurality of first metal blocks, a second central block and a plurality of second metal blocks, a first finish layer and a second finish layer, at least a chip disposed on the metal sheet and a package body encapsulating the chip. The package structure may further include at least an area block for wire routing.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: November 13, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Bernd Karl Appelt, Kay Essig, Yuan-Chang Su, Chun-Che Lee, Kuang-Hsiung Chen
  • LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20120091569
    Abstract: The package structure includes a metal sheet having a first central block, a plurality of first metal blocks, a second central block and a plurality of second metal blocks, a first finish layer and a second finish layer, at least a chip disposed on the metal sheet and a package body encapsulating the chip. The package structure may further include at least an area block for wire routing.
    Type: Application
    Filed: October 15, 2010
    Publication date: April 19, 2012
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Bernd Karl Appelt, Kay Essig, Yuan-Chang Su, Chun-Che Lee, Kuang-Hsiung Chen