Patents by Inventor Kay Jin Lee

Kay Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of wafer marking for multi-layer metal processes
    Patent number: 6743694
    Abstract: A new method of forming a laser mark without damage to the wafer surface is described. A pad oxide layer is formed on a silicon wafer. A nitride layer is deposited overlying the pad oxide layer. A first trench is laser cut through the nitride layer and the pad oxide layer into the silicon wafer. The trench is etched to a second depth wherein the nitride layer is used as a hard mask and wherein the trench forms an identification mark.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: June 1, 2004
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Ching Thiam Chung, Kay Jin Lee
  • Method of wafer marking for multi-layer metal processes
    Publication number: 20030203589
    Abstract: A new method of forming a laser mark without damage to the wafer surface is described. A pad oxide layer is formed on a silicon wafer. A nitride layer is deposited overlying the pad oxide layer. A first trench is laser cut through the nitride layer and the pad oxide layer into the silicon wafer. The trench is etched to a second depth wherein the nitride layer is used as a hard mask and wherein the trench forms an identification mark.
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Applicant: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Ching Thiam Chung, Kay Jin Lee