Patents by Inventor Kay Kit Tan

Kay Kit Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 7112048
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: September 26, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 6720666
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: April 13, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Patent number: 6692987
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: February 17, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Method for molding semiconductor components
    Patent number: 6652799
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: November 25, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030211659
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030211660
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • BOC BGA package for die with I-shaped bond pad layout
    Publication number: 20030148557
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: February 5, 2002
    Publication date: August 7, 2003
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Apparatus for molding semiconductor components
    Patent number: 6439869
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: August 27, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
  • Method for molding semiconductor components
    Publication number: 20020056942
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit - Tan