Patents by Inventor Kay-Oliver THIEL

Kay-Oliver THIEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9783891
    Abstract: An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: October 10, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Jacob Blickensderfer, Rohan Akolkar, Paige Altemare, Kay-Oliver Thiel, Hans-Jürgen Schreier
  • Publication number: 20170121824
    Abstract: An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.
    Type: Application
    Filed: March 17, 2015
    Publication date: May 4, 2017
    Applicant: Atotech Deutschland GMBH
    Inventors: Jacob BLICKENSDERFER, Rohan AKOLKAR, Paige ALTEMARE, Kay-Oliver THIEL, Hans-Jürgen SCHREIER