Abstract: A method of patterning a thin-film photovoltaic layer stack includes the steps of providing a continuous layer stack comprising a planar substrate, a first electrode layer on the substrate and a photovoltaic layer on the first electrode layer, immersing the layer stack into an electrically conductive solution, applying a bias voltage between the electrolyte solution and the first electrode layer and converting a first material or a first material composition provided in at least a first portion of the layer stack into a first reaction product by an electrochemical reaction, wherein the first reaction product has an electrical conductivity that is lower than an electrical conductivity of the first material or first material composition, or removing a first material or a first material composition provided in at least a first portion of the layer stack by an electrochemical reaction.

Abstract: System testing is described. An example system testing method includes: acquiring module relationship information for a system under test, the system under test including a plurality of modules, the module relationship information indicating a logical relationship between each two of the plurality of modules; and testing at least two modules in the system under test based on the module relationship information, the at least two modules being associated with each other for the same function implemented by the system under test. By use of the technical solution of the present disclosure, both system and module perspectives can be applied to system integration testing, so as to achieve a more comprehensive system testing coverage and find problems in the system under test as soon as possible, which can help to improve the system testing coverage and system testing efficiency.

Abstract: Methods, system, and non-transitory processor-readable storage medium for bug fix system are provided herein. An example method includes executing at least one test on a system using an automated test tool. The bug fix system predicts at least one characteristic of a test related failure that occurred during the execution using test data produced by the automated test tool. The bug fix system predicts at least one source of the test related failure using the test data produced by the automated test tool.