Abstract: A SRAM cell, including, in a stack of layers, transistors including at least first and second access transistors connected to a word line, the first access transistor coupling a first bit line and a first storage node and the second access transistor coupling a second bit line and a second storage node, and a flip-flop including a first conduction transistor coupling the first storage node to a source of a first reference potential and having its gate coupled to the second storage node and a second conduction transistor coupling the second storage node to the source of the first reference potential and having its gate coupled to the first storage node.

Abstract: A memory circuit capable of implementing calculation operations, including: memory cells arranged in rows and in columns, each cell including: a data bit storage node, a read-out transistor connected by its gate to the storage node, and a selection transistor series-connected with the read-out transistor between a reference node and a conductive output track common to all the cells of a same column; and a control circuit configured to simultaneously activate the selection transistors of at least two cells of a same column of the circuit, and to read from the conductive output track of the column a value representative of the result of a logic operation having as operands the data of the two cells.

Abstract: A memory circuit capable of implementing calculation operations, including: memory cells arranged in rows and in columns, each cell including: a data bit storage node, a read-out transistor connected by its gate to the storage node, and a selection transistor series-connected with the read-out transistor between a reference node and a conductive output track common to all the cells of a same column; and a control circuit configured to simultaneously activate the selection transistors of at least two cells of a same column of the circuit, and to read from the conductive output track of the column a value representative of the result of a logic operation having as operands the data of the two cells.

Abstract: An SRAM cell is formed of FDSOI-type NMOS and PMOS transistors. A doped well extends under the NMOS and PMOS transistors and is separated therefrom by an insulating layer. A bias voltage is applied to the doped well. The applied bias voltage is adjusted according to a state of the memory cell. For example, a temperature of the memory cell is sensed and the bias voltage adjusted as a function of the sensed temperature. The adjustment in the bias voltage is configured so that threshold voltages of the NMOS and PMOS transistors are substantially equal to n and p target threshold voltages, respectively.

Abstract: An SRAM cell is formed of FDSOI-type NMOS and PMOS transistors. A doped well extends under the NMOS and PMOS transistors and is separated therefrom by an insulating layer. A bias voltage is applied to the doped well. The applied bias voltage is adjusted according to a state of the memory cell. For example, a temperature of the memory cell is sensed and the bias voltage adjusted as a function of the sensed temperature. The adjustment in the bias voltage is configured so that threshold voltages of the NMOS and PMOS transistors are substantially equal to n and p target threshold voltages, respectively.