Patents by Inventor Kayako Ito

Kayako Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide resin composition
    Patent number: 5580918
    Abstract: A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by the following formula (1): ##STR1## wherein X represents a direct bond, a hydrocarbon group, a carbonyl group, a thio group or so, Y.sub.1 -Y.sub.4 individually represent a hydrogen atom, a lower alkyl group or so and R.sub.1 represents an aliphatic group, an aromatic group or so; and 50-5 parts by weight of a polyetheretherketone, said composition having been subjected to heat treatment at 250.degree.-330.degree. C. and, after the heat-treatment, having crystallization enthalpy of 0-6 cal/g.The heat treatment of the polyimide resin composition can be effected at a low temperature in a short time. The polyimide resin composition has excellent dimensional stability and high-temperature physical properties. Moreover, it has excellent moldability and peeling resistance.
    Type: Grant
    Filed: February 16, 1994
    Date of Patent: December 3, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Atsushi Morita, Yoshihisa Gotoh, Toshiaki Takahashi, Kayako Ito, Hiroyasu Oochi, Tomohito Koba, Katunori Simamura, Hiroaki Tomimoto, Nobuhiro Takizawa
  • Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers
    Patent number: 5514748
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 7, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toshihiko Isutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito
  • Polyimide based resin composition
    Patent number: 5312866
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: May 14, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito