Patents by Inventor Kayen Lin

Kayen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ethernet magnetics package wire terminations
    Patent number: 10446312
    Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 15, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: William Frank Edwards, Ki-Yuen Chau, Keith Frank Tharp, George Curtis, Kayen Lin
  • ETHERNET MAGNETICS PACKAGE WIRE TERMINATIONS
    Publication number: 20180096774
    Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
    Type: Application
    Filed: November 17, 2017
    Publication date: April 5, 2018
    Inventors: William Frank Edwards, Ki-Yuen Chau, Keith Frank Tharp, George Curtis, Kayen Lin
  • Ethernet magnetics package wire terminations
    Patent number: 9881725
    Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: January 30, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: William Frank Edwards, Ki-Yuen Chau, Keith Frank Tharp, George Curtis, Kayen Lin