Patents by Inventor Kayleen L. E. Helms

Kayleen L. E. Helms has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230084375
    Abstract: An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 16, 2023
    Applicant: Intel Corporation
    Inventors: Priyanka Dobriyal, Ankur Agrawal, Anna M. Prakash, Ann J. Xu, Jimin Yao, Raiyomand F. Aspandiar, Lesley A. Polka Wood, Abigail G. Agwai, Kayleen L. E. Helms