Patents by Inventor Kayo Hamano

Kayo Hamano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component utilizing face-down mounting
    Patent number: 6351194
    Abstract: An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed circuit board, a metal cover for covering the plurality of electronic components remaining a space or a cavity between the top surface of the printed circuit board and the inner surface of the metal cover having a flange surrounding the outskirts of the metal cover to be adhered to the top surface of the multi-layered printed circuit board, and a heat conductive member packed between the bottom surface of the electronic components, wherein the multi-layered printed circuit board has at least one through-hole vertically penetrating the multi-layered printed circuit board at a location corresponding to the flange and is lined by a metal film, and the multi-layered printed circuit board has a heat conductive layer arranged along the rear surface of the multi-layered printed circuit board, the heat conductive layer being
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: February 26, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Yoshiro Takahashi, Kei Nakakuki, Satoshi Itaya, Kayo Hamano
  • ELECTRONIC COMPONENT UTILIZING FACE-DOWN MOUNTING
    Publication number: 20020000895
    Abstract: An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed circuit board, a metal cover for covering the plurality of electronic components remaining a space or a cavity between the top surface of the printed circuit board and the inner surface of the metal cover having a flange surrounding the outskirts of the metal cover to be adhered the top surface of the multi-layered printed circuit board, and a heat conductive member packed between the bottom surface of the electronic components, wherein the multi-layered printed circuit board has at least one through-hole vertically penetrating the multi-layered printed circuit board at a location corresponding to the flange and is lined by a metal film, and the multi-layered printed circuit board has a heat conductive layer arranged along the rear surface of the multi-layered printed circuit board, the heat conductive layer being co
    Type: Application
    Filed: June 29, 1998
    Publication date: January 3, 2002
    Inventors: YOSHIRO TAKAHASHI, KEI NAKAKUKI, SATOSHI ITAYA, KAYO HAMANO