Patents by Inventor Kayo KONDO

Kayo KONDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220190202
    Abstract: A light-emitting element includes an n-type contact layer which includes AlGaN and in which a Fermi level and a conduction band are in degeneracy, and a light-emitting layer including AlGaN and being stacked on the n-type contact layer. An Al composition x of the n-type contact layer is not less than 0.1 greater than an Al composition x of the light-emitting layer. The n-type contact layer has an effective donor concentration that is a concentration to cause the degeneracy and that is not more than 4.0×1019 cm?3.
    Type: Application
    Filed: November 18, 2021
    Publication date: June 16, 2022
    Inventors: Kengo NAGATA, Yoshiki SAITO, Keita KATAOKA, Tetsuo NARITA, Kayo KONDO
  • Air-conditioning control system and air-conditioning control method
    Patent number: 11060751
    Abstract: An air-conditioning control system configured to control air conditioning in a building that includes an air-conditioning room in which an air conditioner is provided and a first air-inflow room into which air flows from the air-conditioning room. The air-conditioning control system includes: a temperature obtaining unit configured to obtain a temperature of the first air-inflow room; and a controller configured to control the air conditioner, based on the temperature obtained by the temperature obtaining unit.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: July 13, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hayato Takahashi, Kayo Kondo
  • AIR-CONDITIONING CONTROL SYSTEM AND AIR-CONDITIONING CONTROL METHOD
    Publication number: 20190360715
    Abstract: An air-conditioning control system configured to control air conditioning in a building that includes an air-conditioning room in which an air conditioner is provided and a first air-inflow room into which air flows from the air-conditioning room. The air-conditioning control system includes: a temperature obtaining unit configured to obtain a temperature of the first air-inflow room; and a controller configured to control the air conditioner, based on the temperature obtained by the temperature obtaining unit.
    Type: Application
    Filed: January 23, 2018
    Publication date: November 28, 2019
    Inventors: Hayato TAKAHASHI, Kayo KONDO
  • Silicon carbide semiconductor device having metal silicide surrounds a peripheral of metal carbide
    Patent number: 10361274
    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate that has a front surface and a rear surface, and is made of silicon carbide; and an ohmic electrode that is ohmically connected to the front surface or the rear surface of the semiconductor substrate. The ohmic electrode includes a metal silicide part and a metal carbide part. The metal silicide part surrounds a periphery of the metal carbide part that has a block shape. The metal silicide part is disposed between the semiconductor substrate and the metal carbide part.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: July 23, 2019
    Assignee: DENSO CORPORATION
    Inventors: Jun Kawai, Kazuhiko Sugiura, Yasuji Kimoto, Kayo Kondo
  • SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
    Publication number: 20180323261
    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate that has a front surface and a rear surface, and is made of silicon carbide; and an ohmic electrode that is ohmically connected to the front surface or the rear surface of the semiconductor substrate. The ohmic electrode includes a metal silicide part and a metal carbide part. The metal silicide part surrounds a periphery of the metal carbide part that has a block shape. The metal silicide part is disposed between the semiconductor substrate and the metal carbide part.
    Type: Application
    Filed: February 28, 2017
    Publication date: November 8, 2018
    Applicant: DENSO CORPORATION
    Inventors: Jun KAWAI, Kazuhiko SUGIURA, Yasuji KIMOTO, Kayo KONDO