Patents by Inventor Kayoko Nagahara

Kayoko Nagahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9090799
    Abstract: Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: July 28, 2015
    Assignee: FUJIMI INCORPORATED
    Inventors: Toshio Shinoda, Kayoko Nagahara, Yutaka Inoue, Shuhei Takahashi, Toshihiro Miwa
  • Publication number: 20130260650
    Abstract: Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.
    Type: Application
    Filed: November 7, 2011
    Publication date: October 3, 2013
    Inventors: Toshio Shinoda, Kayoko Nagahara, Yutaka Inoue, Shuhei Takahashi, Toshihiro Miwa