Patents by Inventor Kayou Kusano

Kayou Kusano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10102971
    Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 16, 2018
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Masahiro Mori, Sunao Masuda, Kayou Kusano
  • Patent number: 9916929
    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: March 13, 2018
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Kusano
  • Patent number: 9881742
    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: January 30, 2018
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Kusano
  • Publication number: 20170103852
    Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.
    Type: Application
    Filed: October 5, 2016
    Publication date: April 13, 2017
    Applicant: TDK CORPORATION
    Inventors: Norihisa ANDO, Masahiro MORI, Sunao MASUDA, Kayou KUSANO
  • Publication number: 20160351333
    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
    Type: Application
    Filed: April 29, 2016
    Publication date: December 1, 2016
    Applicant: TDK CORPORATION
    Inventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou KUSANO
  • Publication number: 20160343504
    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.
    Type: Application
    Filed: April 29, 2016
    Publication date: November 24, 2016
    Applicant: TDK CORPORATION
    Inventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou KUSANO
  • Patent number: 9105405
    Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: August 11, 2015
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi, Takashi Komatsu, Akitoshi Yoshii, Kazuyuki Hasebe, Kayou Kusano, Norihisa Ando
  • Patent number: 9042079
    Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: May 26, 2015
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi, Akitoshi Yoshii, Kazuyuki Hasebe, Takashi Komatsu, Kayou Kusano
  • Publication number: 20140118882
    Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
    Type: Application
    Filed: September 11, 2013
    Publication date: May 1, 2014
    Inventors: Sunao MASUDA, Katsumi KOBAYASHI, Takashi KOMATSU, Akitoshi YOSHII, Kazuyuki HASEBE, Kayou KUSANO, Norihisa ANDO
  • Publication number: 20140055910
    Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face
    Type: Application
    Filed: August 22, 2013
    Publication date: February 27, 2014
    Applicant: TDK Corporation
    Inventors: Sunao MASUDA, Katsumi Kobayashi, Akitoshi Yoshii, Kazuyuki Hasebe, Takashi Komatsu, Kayou Kusano