Patents by Inventor Kayou MATSUNAGA
Kayou MATSUNAGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11443897Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.Type: GrantFiled: April 29, 2021Date of Patent: September 13, 2022Assignee: TDK CORPORATIONInventors: Toshihiro Iguchi, Norihisa Ando, Kenya Tamaki, Kayou Matsunaga
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Patent number: 11430607Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.Type: GrantFiled: May 17, 2021Date of Patent: August 30, 2022Assignee: TDK CORPORATIONInventors: Toshihiro Iguchi, Norihisa Ando, Kenya Tamaki, Kayou Matsunaga
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Patent number: 11302473Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.Type: GrantFiled: June 25, 2019Date of Patent: April 12, 2022Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Publication number: 20210366654Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.Type: ApplicationFiled: May 17, 2021Publication date: November 25, 2021Applicant: TDK CORPORATIONInventors: Toshihiro IGUCHI, Norihisa ANDO, Kenya TAMAKI, Kayou MATSUNAGA
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Publication number: 20210358690Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.Type: ApplicationFiled: April 29, 2021Publication date: November 18, 2021Applicant: TDK CORPORATIONInventors: Toshihiro IGUCHI, Norihisa ANDO, Kenya TAMAKI, Kayou MATSUNAGA
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Patent number: 11081275Abstract: An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.Type: GrantFiled: May 17, 2019Date of Patent: August 3, 2021Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa, Jin Murakami
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Patent number: 10984953Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.Type: GrantFiled: March 29, 2019Date of Patent: April 20, 2021Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10984950Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.Type: GrantFiled: August 7, 2020Date of Patent: April 20, 2021Assignee: TDK CORPORATIONInventors: Norihisa Ando, Kenichi Inoue, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10916375Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.Type: GrantFiled: March 28, 2019Date of Patent: February 9, 2021Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Publication number: 20200388438Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.Type: ApplicationFiled: August 7, 2020Publication date: December 10, 2020Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Kenichi INOUE, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Patent number: 10818432Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.Type: GrantFiled: September 5, 2018Date of Patent: October 27, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10804035Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.Type: GrantFiled: November 21, 2017Date of Patent: October 13, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Katsumi Kobayashi, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10796854Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.Type: GrantFiled: March 14, 2019Date of Patent: October 6, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10790088Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.Type: GrantFiled: March 12, 2019Date of Patent: September 29, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10777353Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.Type: GrantFiled: September 5, 2018Date of Patent: September 15, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Kenichi Inoue, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10763043Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.Type: GrantFiled: November 21, 2018Date of Patent: September 1, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10763045Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.Type: GrantFiled: September 12, 2017Date of Patent: September 1, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Masahiro Mori, Sunao Masuda, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10714264Abstract: A metal terminal is connectable to terminal electrodes of chip components arranged side by side. The metal terminal includes units corresponding to each chip. Each unit includes an electrode facing portion, a pair of upper and lower holding portions, a mount portion, and protrusions. The electrode facing portion faces the electrode of the chip. The pair of upper and lower holding portions holds the chip. The mount portion is located below the lower holding portion of the electrode facing portion. The protrusions protrude from the electrode facing portion toward the electrode. The protrusions in each unit are arranged substantially line-symmetrically to a virtual center line passing through a middle point between the upper and lower holding portions.Type: GrantFiled: October 19, 2018Date of Patent: July 14, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10607778Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.Type: GrantFiled: November 21, 2017Date of Patent: March 31, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Katsumi Kobayashi, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10566139Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.Type: GrantFiled: October 17, 2018Date of Patent: February 18, 2020Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa