Patents by Inventor Kaysar M. Rahim

Kaysar M. Rahim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder fatigue arrest for wafer level package
    Patent number: 9583425
    Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: February 28, 2017
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov
  • SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
    Publication number: 20140131859
    Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 15, 2014
    Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov