Abstract: An electronic device comprises an enclosure configured for insertion into the ear canal and comprising a distal end configured to extend at least beyond a first bend of the ear canal. A distal temperature sensor is situated at a location of the enclosure that faces a tragus-side of the ear canal between the first and second bends when the enclosure is fully inserted into the ear canal. A proximal temperature sensor is situated on the enclosure at a location spaced apart from a surface of the ear canal and proximal of the distal temperature sensor in an outer ear direction when the enclosure is fully inserted into the ear canal. A processor, coupled to the distal and proximal temperature sensors and to memory, is configured to calculate an absolute core body temperature using a heat balance equation stored in the memory and the first and second temperature signals.

Abstract: An electronic device comprises an enclosure configured for insertion into the ear canal and comprising a distal end configured to extend at least beyond a first bend of the ear canal. A distal temperature sensor is situated at a location of the enclosure that faces a tragus-side of the ear canal between the first and second bends when the enclosure is fully inserted into the ear canal. A proximal temperature sensor is situated on the enclosure at a location spaced apart from a surface of the ear canal and proximal of the distal temperature sensor in an outer ear direction when the enclosure is fully inserted into the ear canal. A processor, coupled to the distal and proximal temperature sensors and to memory, is configured to calculate an absolute core body temperature using a heat balance equation stored in the memory and the first and second temperature signals.

Abstract: An electronic device comprises an enclosure configured for insertion into the ear canal and comprising a distal end configured to extend at least beyond a first bend of the ear canal. A distal temperature sensor is situated at a location of the enclosure that faces a tragus-side of the ear canal between the first and second bends when the enclosure is fully inserted into the ear canal. A proximal temperature sensor is situated on the enclosure at a location spaced apart from a surface of the ear canal and proximal of the distal temperature sensor in an outer ear direction when the enclosure is fully inserted into the ear canal. A processor, coupled to the distal and proximal temperature sensors and to memory, is configured to calculate an absolute core body temperature using a heat balance equation stored in the memory and the first and second temperature signals.

Abstract: An electronic device comprises an enclosure configured for insertion into the ear canal and comprising a distal end configured to extend at least beyond a first bend of the ear canal. A distal temperature sensor is situated at a location of the enclosure that faces a tragus-side of the ear canal between the first and second bends when the enclosure is fully inserted into the ear canal. A proximal temperature sensor is situated on the enclosure at a location spaced apart from a surface of the ear canal and proximal of the distal temperature sensor in an outer ear direction when the enclosure is fully inserted into the ear canal. A processor, coupled to the distal and proximal temperature sensors and to memory, is configured to calculate an absolute core body temperature using a heat balance equation stored in the memory and the first and second temperature signals.

Abstract: An ear-worn electronic device comprises a housing configured for insertion into an ear canal and comprising a proximal section and a distal section. The distal section comprises a distal end configured to terminate prior to a second bend of the ear canal when the housing is fully inserted into the ear canal. An inner waveguide is disposed in the housing and extends to the distal end. A waveguide extension is coupled to the distal end and dimensioned to extend past the second bend of the ear canal when the housing is fully inserted into the ear canal. The waveguide extension is communicatively coupled to the inner waveguide. An articulation mechanism is situated between the waveguide and the waveguide extension. The articulation mechanism is configured to facilitate articulation of the waveguide extension relative to the inner waveguide during insertion of the housing into the ear canal.

Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.