Abstract: An apparatus for receiving and securing a processor on a mainboard in a computer system. The apparatus includes a socket and socket loading mechanism for a land grid array. The apparatus provides a load distribution mechanism to dissipate tensile and shearing forces at the corner of the socket to protect a solder ball grid array. This improves the durability of the solder ball grid array and increases the power of the processors that may be supported by the socket.

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract: A centrifugal pump with a hydrodynamic bearing and a double involute is disclosed. Some embodiments may include an impeller housing comprising a fluid entrance to allow fluid to enter and an impeller located within the impeller housing, the impeller comprising a plurality of impeller blades, a plurality of fluid channels between the impeller blades, and a motor magnet. The impeller may rotate within the impeller housing about a pump centerline in response to an electromagnetic field and the fluid channels may each allow fluid to pass through when the impeller rotates. Embodiments may also include one or more hydrodynamic bearings positioned between the impeller and the impeller housing to support generated loads and a double involute coupled with the impeller housing and positioned to receive fluid exiting the plurality of fluid channels. Further embodiments may include a motor stator to generate the electromagnetic field. Other embodiments are disclosed and claimed.

Abstract: Generally speaking, a system with a metallic component and a thermoplastic component is disclosed. The metallic component may include a metallic outer surface and the thermoplastic component may be formed around the metallic outer surface to create a seal between the thermoplastic housing and the metallic component. In some embodiments, the thermoplastic component may include an inner surface and an outer surface where the inner surface is formed adjacent to an in contact with the metallic outer surface. Embodiments may also include a sealing ring positioned on the outer surface of the thermoplastic housing to provide a compressive spring force to the thermoplastic housing, where the force applied to the thermoplastic housing improves the seal between the thermoplastic component and the metallic component. In a further embodiment, the metallic component is a metallic cold plate and the thermoplastic component is a thermoplastic pump housing. Other embodiments are disclosed and claimed.

Abstract: According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.