Abstract: According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

Abstract: A microelectronic assembly includes a die (110, 210) having a surface (111, 211), a heat sink (120, 220) removably attached to the die, a thermally conductive layer (130, 230) between the die and the heat sink, and an anti-adhesion layer (140, 240) between the die and the heat sink. The thermally conductive layer conforms to a contour of the surface of the die.

Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.

Abstract: An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The radial heat sink includes a core having an outer surface, and a plurality of helical fins that extend from the outer surface of the core. The electronic assembly may include a fan positioned near the heat sink. The appropriate angle for the helical fins relative to the longitudinal axis of the heat sink depends in part on the direction of the airflow that is produced by the fan.

Abstract: An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The radial heat sink includes a core having an outer surface, and a plurality of helical fins that extend from the outer surface of the core. The electronic assembly may include a fan positioned near the heat sink. The appropriate angle for the helical fins relative to the longitudinal axis of the heat sink depends in part on the direction of the airflow that is produced by the fan.

Abstract: A heat sink for cooling a microelectronic device, and methods of manufacturing and operating the heat sink. The heat sink includes a plurality of fins, folded from a strip of thermally conductive material, arranged in a radial pattern. A fan may be disposed at a center of the radial pattern to direct airflow radially outward over the folded fins.

Abstract: A heat sink for cooling a microelectronic device, and methods of manufacturing and operating the heat sink. The heat sink includes a plurality of fins, folded from a strip of thermally conductive material, arranged in a radial pattern. A fan may be disposed at a center of the radial pattern to direct airflow radially outward over the folded fins.

Abstract: Disclosed is structure and method for supplying and cutting off power to a removable card component of an electrical device, without interfering with supply of power to other components of the device (including other card components), so that the single card component can be serviced (removed/replaced/added) without interfering with supply of electrical power to other components of the electrical device. The structure includes a slider member on the frame of the device, which slides on the frame between first and second positions on the frame, and a switch actuated by the slider member.