Patents by Inventor Kazuaki Aoki

Kazuaki Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190374556
    Abstract: Provided are compositions, methods and devices for reducing scarring during healing of a tissue wound. The compositions and methods involve use of sphingosine-1-phosphate (S1P), and/or an expression vector that encodes sphingosine kinasel (SphK1). The compositions can be combined with other agents and implements, such as biocompatible nanoparticles, and medical devices involved with promoting wound healing. The approaches can reduce formation or prevent the occurrence of keloids.
    Type: Application
    Filed: February 2, 2018
    Publication date: December 12, 2019
    Inventors: Kazuaki TAKABE, Masayo Aoki
  • Patent number: 10415533
    Abstract: An ignition apparatus for internal combustion engines is provided. The ignition apparatus is equipped with an ECU. The ECU monitors a path length of a discharge of a spark for a period of time in which a second circuit delivers or inputs energy in the form of a threshold value determination. When the path length has become too short, the ECU determines that ignition is expected to be delayed and then selects a special mode to control the delay of the ignition. The ECU increase a target value of an energy input amount. This enables the delay of ignition resulting from a short extension of the path length to be minimized. The ignition apparatus equipped with the second circuit to continue the discharge of sparks is, thus, capable of reducing a variation in ignition without the need for uniformly increasing the energy input amount.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: September 17, 2019
    Assignees: DENSO CORPORATION, SOKEN, INC.
    Inventors: Hideaki Kosuge, Fumiaki Aoki, Shohei Ishida, Shunichi Takeda, Kazuaki Ueda
  • Patent number: 9987721
    Abstract: A double-side polishing method of polishing both surfaces of a wafer by holding the wafer with a carrier including a holding hole configured to hold the wafer and a ring-shaped resin insert disposed along an internal circumference of the holding hole, the resin insert having an inner circumferential surface configured to contact a peripheral portion of the wafer, interposing the carrier between upper and lower turn tables to which polishing pads are attached, polishing both the surfaces of the wafer while maintaining planarity of the inner circumferential surface at or below 100 ?m and verticalness of the inner circumferential surface at or below 5°. The method can inhibit the degradation of the flatness of the polished wafer, such as particularly an outer circumferential sag, due to variation in shape of the inner circumferential surface of the resin insert of a carrier.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: June 5, 2018
    Inventors: Masanao Sasaki, Kazuaki Aoki, Taichi Yasuda, Taketoshi Sato, Takehiro Yuasa, Kazumasa Asai, Daisuke Furukawa
  • Patent number: 9748089
    Abstract: A method for producing mirror-polished wafer, the method produces a plurality of mirror-polished wafers by performing, on plurality of silicon wafers obtained by slicing a silicon ingot, slicing strain removing step of removing strain on a surface caused by slicing, etching step of removing strain caused by the slicing strain removing step, and double-side polishing step of performing mirror polishing on both surfaces of the silicon wafers subjected to etching, each step being performed by batch processing, wherein silicon wafers which are processed in double-side polishing step by batch processing are selected from silicon wafers processed in same batch in the slicing strain removing step and the number of silicon wafers to be selected is made to be equal to the number of silicon wafers processed in the slicing strain removing step or submultiple thereof. As a result, a method that can produce mirror-polished wafers having high flatness is provided.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: August 29, 2017
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Hiromasa Hashimoto, Yoshihiro Usami, Kazuaki Aoki, Shigeru Oba
  • Publication number: 20160217998
    Abstract: A method for producing mirror-polished wafer, the method produces a plurality of mirror-polished wafers by performing, on plurality of silicon wafers obtained by slicing a silicon ingot, slicing strain removing step of removing strain on a surface caused by slicing, etching step of removing strain caused by the slicing strain removing step, and double-side polishing step of performing mirror polishing on both surfaces of the silicon wafers subjected to etching, each step being performed by batch processing, wherein silicon wafers which are processed in double-side polishing step by batch processing are selected from silicon wafers processed in same batch in the slicing strain removing step and the number of silicon wafers to be selected is made to be equal to the number of silicon wafers processed in the slicing strain removing step or submultiple thereof. As a result, a method that can produce mirror-polished wafers having high flatness is provided.
    Type: Application
    Filed: August 20, 2014
    Publication date: July 28, 2016
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Hiromasa HASHIMOTO, Yoshihiro USAMI, Kazuaki AOKI, Shigeru OBA
  • Patent number: 9156123
    Abstract: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: October 13, 2015
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuaki Aoki, Shigeru Oba
  • Publication number: 20150217425
    Abstract: A double-side polishing method of polishing both surfaces of a wafer by holding the wafer with a carrier including a holding hole configured to hold the wafer and a ring-shaped resin insert disposed along an internal circumference of the holding hole, the resin insert having an inner circumferential surface configured to contact a peripheral portion of the wafer, interposing the carrier between upper and lower turn tables to which polishing pads are attached, polishing both the surfaces of the wafer while maintaining planarity of the inner circumferential surface at or below 100 ?m and verticalness of the inner circumferential surface at or below 5°. The method can inhibit the degradation of the flatness of the polished wafer, such as particularly an outer circumferential sag, due to variation in shape of the inner circumferential surface of the resin insert of a carrier.
    Type: Application
    Filed: August 8, 2013
    Publication date: August 6, 2015
    Applicant: Shin-Etsu Handotai Co., Ltd.
    Inventors: Masanao Sasaki, Kazuaki Aoki, Taichi Yasuda, Taketoshi Sato, Takehiro Yuasa, Kazumasa Asai, Daisuke Furukawa
  • Patent number: 8918044
    Abstract: An image heating apparatus includes a hollow image heating roller having a through hole at one axial end portion side thereof; a bearing fitted around the roller; a heat insulating bush fitted around the roller between the roller and the bearing; a retaining ring for preventing the heat insulating bush from moving relative to the roller; an annular spacer provided between the heat insulating bush and the retaining ring, the annular spacer being provided with an inwardly protruded key portion engageable with the through hole.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: December 23, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Takematsu, Kazuaki Aoki, Shouhei Takeda, Yasuo Nami, Naoyuki Yamamoto, Masahiro Nawa
  • Patent number: 8843042
    Abstract: An image heating apparatus includes a roller, a heating portion disposed within the roller, a bearing portion fitted around an end portion of the roller to rotably support the roller, and a retaining ring attached at an axially predetermined position of the roller to restrict the roller from moving in a axial direction of the roller with respect to the bearing portion. The retaining ring includes first and second projections fitted into a hole portion of the roller. Profiles of side surfaces of these first and second projections abutting edges of the hole portion in a circumferential direction are recessed in the circumferential direction.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: September 23, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masahiro Nawa, Kazuaki Aoki, Shouhei Takeda, Yasuo Nami, Naoyuki Yamamoto, Koji Takematsu
  • Patent number: 8843046
    Abstract: An image heater a hollow heating roller having a hole at an axial end portion thereof; a bearing supporting the heating roller; a heat insulating bush fitted between an outer surface of the heating roller and the bearing; a retaining ring for retaining the heat insulating bush in an axial direction of the heating roller, the retaining ring including a projection engaging with the hole; an annular spacer provided between the retaining ring and the heat insulating bush, wherein the spacer includes a connecting portion having a connecting hole, the retaining ring includes a hooking portion engaging with the connecting hole.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: September 23, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masahiro Nawa, Kazuaki Aoki, Shouhei Takeda, Yasuo Nami, Naoyuki Yamamoto, Koji Takematsu
  • Publication number: 20140256227
    Abstract: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.
    Type: Application
    Filed: October 4, 2012
    Publication date: September 11, 2014
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuaki Aoki, Shigeru Oba
  • Patent number: 8781364
    Abstract: A replacement fixing belt to be used in a fixing apparatus, the replacement fixing belt including: an endless base layer; a toner releasing layer provided on a surface of the replacement fixing belt; and a lubrication film formed on an inner surface of the endless base layer by applying to the inner surface a liquid in which a fluorinated oil and fluorinated solid lubricant particles are dispersed in a volatile solvent.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: July 15, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takeshi Fukuda, Kazuaki Aoki
  • Publication number: 20130084102
    Abstract: A replacement fixing belt to be used in a fixing apparatus, the replacement fixing belt including: an endless base layer; a toner releasing layer provided on a surface of the replacement fixing belt; and a lubrication film formed on an inner surface of the endless base layer by applying to the inner surface a liquid in which a fluorinated oil and fluorinated solid lubricant particles are dispersed in a volatile solvent.
    Type: Application
    Filed: August 30, 2012
    Publication date: April 4, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takeshi Fukuda, Kazuaki Aoki
  • Publication number: 20120328338
    Abstract: An image heating apparatus includes a roller, a heating portion disposed within the roller, a bearing portion fitted around an end portion of the roller to rotably support the roller, and a retaining ring attached at an axially predetermined position of the roller to restrict the roller from moving in a axial direction of the roller with respect to the bearing portion. The retaining ring includes first and second projections fitted into a hole portion of the roller. Profiles of side surfaces of these first and second projections abutting edges of the hole portion in a circumferential direction are recessed in the circumferential direction.
    Type: Application
    Filed: May 24, 2012
    Publication date: December 27, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Masahiro Nawa, Kazuaki Aoki, Shouhei Takeda, Yasuo Nami, Naoyuki Yamamoto, Koji Takematsu
  • Publication number: 20120328342
    Abstract: An image heating apparatus includes a hollow image heating roller having a through hole at one axial end portion side thereof; a bearing fitted around the roller; a heat insulating bush fitted around the roller between the roller and the bearing; a retaining ring for preventing the heat insulating bush from moving relative to the roller; an annular spacer provided between the heat insulating bush and the retaining ring, the annular spacer being provided with an inwardly protruded key portion engageable with the through hole.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 27, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Takematsu, Kazuaki Aoki, Shouhei Takeda, Yasuo Nami, Naoyuki Yamamoto, Masahiro Nawa
  • Patent number: 7802877
    Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: September 28, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Kazuhiro Hashii, Satoshi Shinada, Yasuto Sakai, Kazumasa Harada, Kazuaki Aoki
  • Patent number: 7686441
    Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: March 30, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Kazuhiro Hashii, Satoshi Shinada, Yasuto Sakai, Kazumasa Harada, Kazuaki Aoki
  • Patent number: 7669993
    Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: March 2, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Kazuhiro Hashii, Satoshi Shinada, Yasuto Sakai, Kazumasa Harada, Kazuaki Aoki
  • Patent number: 7614731
    Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: November 10, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Kazuhiro Hashii, Satoshi Shinada, Yasuto Sakai, Kazumasa Harada, Kazuaki Aoki
  • Patent number: 7539449
    Abstract: A fixing apparatus 50 capable of reducing noise during a fixing operation using a fixing belt 1 having a metal layer includes the fixing belt 1 stretched between a fixation roller 2 and a fixation tension roller 3. The fixing apparatus 50 further includes a coil 4b which is disposed opposite from the fixation tension roller 3 via the fixing belt 1 and is supplied with an AC (600 V, 25 kHz at maximum) by an IH controller 10, so that the fixing belt 1 and the fixation tension roller 3 are simultaneously heated by induction heating. In the fixing apparatus 50, insulating belt flanges 25a and 25b are attached to the fixation tension roller 3 at both end portions of the fixation tension roller 3 to limit movement of the fixing belt 1 in a width direction of the fixing belt 1.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: May 26, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kazuaki Aoki