Abstract: Because the pressure angle ?° (=12°) of teeth (47) of a worm wheel (46) is larger than the pressure angle ?° (=11°) of teeth (45) of a worm (44), tips of the teeth (47) of the worm wheel (46) can be more tapered as compared with a case in which the pressure angle of the teeth of the worm and the pressure angle of the teeth of the worm wheel are the same angle (the conventional case). Thereby, it is possible to ensure non-contact of teeth, which had been variable in terms of contact and non-contact in the case of the conventional form, even if there has been non-uniformity in the teeth (47) of the worm wheel (46).

Abstract: A polishing method for polishing by sliding a semiconductor silicon wafer, held by a polishing head, against a polishing pad attached to a turn table while supplying a polishing agent, wherein the semiconductor silicon wafer is subjected to primary polishing, secondary polishing, and final polishing in turn, the secondary polishing comprises polishing by an alkaline based polishing agent which includes free abrasive grains and does not include a water-soluble polymer agent, and subsequent rinse polishing by a polishing agent which includes a water-soluble polymer agent and the rinse polishing includes two stages of polishing, wherein, after performing a first stage of the rinse polishing while supplying a polishing agent which includes a water-soluble polymer agent, a second stage of the rinse polishing is performed while supplying a switched polishing agent whose water-soluble polymer agent has an average molecular weight larger than the polishing agent of the first stage.

Abstract: Because the pressure angle ?° (=12°) of teeth (47) of a worm wheel (46) is larger than the pressure angle ?° (=11°) of teeth (45) of a worm (44), tips of the teeth (47) of the worm wheel (46) can be more tapered as compared with a case in which the pressure angle of the teeth of the worm and the pressure angle of the teeth of the worm wheel are the same angle (the conventional case). Thereby, it is possible to ensure non-contact of teeth, which had been variable in terms of contact and non-contact in the case of the conventional form, even if there has been non-uniformity in the teeth (47) of the worm wheel (46).

Abstract: A polishing method for polishing by sliding a semiconductor silicon wafer, held by a polishing head, against a polishing pad attached to a turn table while supplying a polishing agent, wherein the semiconductor silicon wafer is subjected to primary polishing, secondary polishing, and final polishing in turn, the secondary polishing comprises polishing by an alkaline based polishing agent which includes free abrasive grains and does not include a water-soluble polymer agent, and subsequent rinse polishing by a polishing agent which includes a water-soluble polymer agent and the rinse polishing includes two stages of polishing, wherein, after performing a first stage of the rinse polishing while supplying a polishing agent which includes a water-soluble polymer agent, a second stage of the rinse polishing is performed while supplying a switched polishing agent whose water-soluble polymer agent has an average molecular weight larger than the polishing agent of the first stage.

Abstract: A double-side polishing method of polishing both surfaces of a wafer by holding the wafer with a carrier including a holding hole configured to hold the wafer and a ring-shaped resin insert disposed along an internal circumference of the holding hole, the resin insert having an inner circumferential surface configured to contact a peripheral portion of the wafer, interposing the carrier between upper and lower turn tables to which polishing pads are attached, polishing both the surfaces of the wafer while maintaining planarity of the inner circumferential surface at or below 100 ?m and verticalness of the inner circumferential surface at or below 5°. The method can inhibit the degradation of the flatness of the polished wafer, such as particularly an outer circumferential sag, due to variation in shape of the inner circumferential surface of the resin insert of a carrier.

Abstract: A method for producing mirror-polished wafer, the method produces a plurality of mirror-polished wafers by performing, on plurality of silicon wafers obtained by slicing a silicon ingot, slicing strain removing step of removing strain on a surface caused by slicing, etching step of removing strain caused by the slicing strain removing step, and double-side polishing step of performing mirror polishing on both surfaces of the silicon wafers subjected to etching, each step being performed by batch processing, wherein silicon wafers which are processed in double-side polishing step by batch processing are selected from silicon wafers processed in same batch in the slicing strain removing step and the number of silicon wafers to be selected is made to be equal to the number of silicon wafers processed in the slicing strain removing step or submultiple thereof. As a result, a method that can produce mirror-polished wafers having high flatness is provided.

Abstract: A method for producing mirror-polished wafer, the method produces a plurality of mirror-polished wafers by performing, on plurality of silicon wafers obtained by slicing a silicon ingot, slicing strain removing step of removing strain on a surface caused by slicing, etching step of removing strain caused by the slicing strain removing step, and double-side polishing step of performing mirror polishing on both surfaces of the silicon wafers subjected to etching, each step being performed by batch processing, wherein silicon wafers which are processed in double-side polishing step by batch processing are selected from silicon wafers processed in same batch in the slicing strain removing step and the number of silicon wafers to be selected is made to be equal to the number of silicon wafers processed in the slicing strain removing step or submultiple thereof. As a result, a method that can produce mirror-polished wafers having high flatness is provided.

Abstract: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.

Abstract: A double-side polishing method of polishing both surfaces of a wafer by holding the wafer with a carrier including a holding hole configured to hold the wafer and a ring-shaped resin insert disposed along an internal circumference of the holding hole, the resin insert having an inner circumferential surface configured to contact a peripheral portion of the wafer, interposing the carrier between upper and lower turn tables to which polishing pads are attached, polishing both the surfaces of the wafer while maintaining planarity of the inner circumferential surface at or below 100 ?m and verticalness of the inner circumferential surface at or below 5°. The method can inhibit the degradation of the flatness of the polished wafer, such as particularly an outer circumferential sag, due to variation in shape of the inner circumferential surface of the resin insert of a carrier.

Abstract: An image heating apparatus includes a hollow image heating roller having a through hole at one axial end portion side thereof; a bearing fitted around the roller; a heat insulating bush fitted around the roller between the roller and the bearing; a retaining ring for preventing the heat insulating bush from moving relative to the roller; an annular spacer provided between the heat insulating bush and the retaining ring, the annular spacer being provided with an inwardly protruded key portion engageable with the through hole.

Abstract: An image heater a hollow heating roller having a hole at an axial end portion thereof; a bearing supporting the heating roller; a heat insulating bush fitted between an outer surface of the heating roller and the bearing; a retaining ring for retaining the heat insulating bush in an axial direction of the heating roller, the retaining ring including a projection engaging with the hole; an annular spacer provided between the retaining ring and the heat insulating bush, wherein the spacer includes a connecting portion having a connecting hole, the retaining ring includes a hooking portion engaging with the connecting hole.

Abstract: An image heating apparatus includes a roller, a heating portion disposed within the roller, a bearing portion fitted around an end portion of the roller to rotably support the roller, and a retaining ring attached at an axially predetermined position of the roller to restrict the roller from moving in a axial direction of the roller with respect to the bearing portion. The retaining ring includes first and second projections fitted into a hole portion of the roller. Profiles of side surfaces of these first and second projections abutting edges of the hole portion in a circumferential direction are recessed in the circumferential direction.

Abstract: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.

Abstract: A replacement fixing belt to be used in a fixing apparatus, the replacement fixing belt including: an endless base layer; a toner releasing layer provided on a surface of the replacement fixing belt; and a lubrication film formed on an inner surface of the endless base layer by applying to the inner surface a liquid in which a fluorinated oil and fluorinated solid lubricant particles are dispersed in a volatile solvent.

Abstract: A replacement fixing belt to be used in a fixing apparatus, the replacement fixing belt including: an endless base layer; a toner releasing layer provided on a surface of the replacement fixing belt; and a lubrication film formed on an inner surface of the endless base layer by applying to the inner surface a liquid in which a fluorinated oil and fluorinated solid lubricant particles are dispersed in a volatile solvent.

Abstract: An image heating apparatus includes a roller, a heating portion disposed within the roller, a bearing portion fitted around an end portion of the roller to rotably support the roller, and a retaining ring attached at an axially predetermined position of the roller to restrict the roller from moving in a axial direction of the roller with respect to the bearing portion. The retaining ring includes first and second projections fitted into a hole portion of the roller. Profiles of side surfaces of these first and second projections abutting edges of the hole portion in a circumferential direction are recessed in the circumferential direction.

Abstract: An image heating apparatus includes a hollow image heating roller having a through hole at one axial end portion side thereof; a bearing fitted around the roller; a heat insulating bush fitted around the roller between the roller and the bearing; a retaining ring for preventing the heat insulating bush from moving relative to the roller; an annular spacer provided between the heat insulating bush and the retaining ring, the annular spacer being provided with an inwardly protruded key portion engageable with the through hole.

Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.

Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.

Abstract: The ink cartridge includes an ink supply port formed at a position, offset to one side, of a wall configuring an ink container body; a positioning projecting portion, formed on one wall out of two opposing walls adjacent the wall, whose upper surface and side portion are regulated in position when the cartridge has been mounted on a recording apparatus; a lever, formed on the other wall out of the two walls, maintaining a normal hinged-open state and having a projection that is forcibly displaced outward when the cartridge is mounted on the recording apparatus; and electrodes that are connected to a memory unit storing information on the ink in an ink container and formed on the positioning projecting portion.