Patents by Inventor Kazuaki Kanazawa

Kazuaki Kanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11237070
    Abstract: A sensor connector compatible with various sensor unit repertoires and capable of improving production efficiency is provided. The sensor connector includes terminal modules to be inserted into a module inserted portion, and commonized pogo pin type terminal module is brought into contact with a connection terminal via slide contact segments capable of sliding relative to the connection terminal exposed to a region closer to the module inserted portion. Thus, the sensor connector can be compatible with the sensor unit 1 having various repertoires by changing, for example, the arrangement and the number of poles of the module inserted portions of the connector housing.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: February 1, 2022
    Assignees: SMK Corporation, DENSO Corporation
    Inventors: Kazuaki Kanazawa, Kiyoshi Asai, Takeshi Horikawa
  • Publication number: 20200292402
    Abstract: A sensor connector compatible with various sensor unit repertoires and capable of improving production efficiency is provided. The sensor connector includes terminal modules to be inserted into a module inserted portion, and commonized pogo pin type terminal module is brought into contact with a connection terminal via slide contact segments capable of sliding relative to the connection terminal exposed to a region closer to the module inserted portion. Thus, the sensor connector can be compatible with the sensor unit 1 having various repertoires by changing, for example, the arrangement and the number of poles of the module inserted portions of the connector housing.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Inventors: Kazuaki KANAZAWA, Kiyoshi ASAI, Takeshi HORIKAWA
  • Patent number: 7232327
    Abstract: An electronic part attachment socket includes a socket housing including an electronic part housing section with an open top into which all or part of an electronic part is housed; and contacts are supported by a socket housing and form an elastic contact with the terminal sections of the electronic part. The electronic part is connected to a printed circuit substrate by way of the contacts. A shield case is formed in a box shape that fits to the outer perimeter of the socket housing, and is formed integrally with a pushing section that projects inward. The shield case is fitted to the socket housing so that it is prevented from slipping off so that the pushing section pushes the electronic part toward the contacts, resulting in the electronic part being housed in the electronic part housing section.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: June 19, 2007
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Patent number: 7147510
    Abstract: An electronic parts installing socket capable of downsizing an electronic device by reducing the height of socket projecting from one surface of the printed circuit board comprises a socket housing fitted into a socket inserting hole. The socket inserting hole penetrates from a front surface to a rear surface of a printed circuit board. Also, a plurality of contacts each having contact pieces disposal on the socket housing and project from a side surface of the socket housing. The contact pieces are connected a contact connecting pattern which is positioned at an opening edge portion of socket inserting hole. Front surface shielding members and are connected to the printed circuit board to shield a portion projecting to the front surface of the printed circuit board. A box shaped rear surface shielding member covers a portion projecting from a rear surface of the printed circuit board to the socket housing and is connected to the front surface shielding members.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: December 12, 2006
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Publication number: 20060051986
    Abstract: An electronic module socket is provided into which camera modules of different shapes can be securely inserted. The electronic module socket includes a socket body with an insertion portion into which an electronic module is engageably inserted and a socket engagement portion that securely engages the electronic module on inner sidewalls of the insertion portion. The electronic module has a shape suitable for securely engaging with the socket engagement portion. An electronic module smaller than the insertion portion of the socket body is engageably secured via a spacer. The spacer has an inner shape that allows the electronic module to be inserted therein and an outer shape capable of being fitted into the insertion portion of the socket body. The spacer is also provided with spacer engagement portions to engage the socket engagement portions.
    Type: Application
    Filed: June 21, 2005
    Publication date: March 9, 2006
    Applicant: SMK CORPORATION
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa
  • Patent number: 6964573
    Abstract: An electronic part-mounting socket includes a socket housing, and contacts The socket housing has contact receiving grooves formed at a bottom plate portion of an electronic part-receiving portion. The contact of an integral construction includes a fixing piece portion, a terminal piece portion laterally bent at a lower end of the fixing piece portion, a first bent-back portion formed by bending back a distal end portion of the terminal piece portion into a U-shape, an intermediate spring piece portion extending laterally from the first bent-back portion, a second bent-back portion formed by bending back a distal end portion of the intermediate spring piece portion into a U-shape, and a resilient contact piece portion extending continuously from the second bent-back portion in an upwardly-slanting manner. The fixing piece portions are inserted respectively in contact fixing holes, formed in the socket housing in an upward-downward direction, and are fixed thereto.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: November 15, 2005
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Publication number: 20050215117
    Abstract: An electronic parts installing socket capable of downsizing an electronic device by reducing the height of socket projecting from one surface of the printed circuit board comprises a socket housing fitted into a socket inserting hole. The socket inserting hole penetrates from a front surface to a rear surface of a printed circuit board. Also, a plurality of contacts each having contact pieces disposal on the socket housing and project from a side surface of the socket housing. The contact pieces are connected a contact connecting pattern which is positioned at an opening edge portion of socket inserting hole. Front surface shielding members and are connected to the printed circuit board to shield a portion projecting to the front surface of the printed circuit board. A box shaped rear surface shielding member covers a portion projecting from a rear surface of the printed circuit board to the socket housing and is connected to the front surface shielding members.
    Type: Application
    Filed: August 23, 2004
    Publication date: September 29, 2005
    Applicant: SMK CORPORATION
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Publication number: 20050215087
    Abstract: An electronic part-mounting socket includes a socket housing, and contacts The socket housing has contact receiving grooves formed at a bottom plate portion of an electronic part-receiving portion. The contact of an integral construction includes a fixing piece portion, a terminal piece portion laterally bent at a lower end of the fixing piece portion, a first bent-back portion formed by bending back a distal end portion of the terminal piece portion into a U-shape, an intermediate spring piece portion extending laterally from the first bent-back portion, a second bent-back portion formed by bending back a distal end portion of the intermediate spring piece portion into a U-shape, and a resilient contact piece portion extending continuously from the second bent-back portion in an upwardly-slanting manner. The fixing piece portions are inserted respectively in contact fixing holes, formed in the socket housing in an upward-downward direction, and are fixed thereto.
    Type: Application
    Filed: March 24, 2005
    Publication date: September 29, 2005
    Applicant: SMK Corporation
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Publication number: 20050215118
    Abstract: An electronic part attachment socket includes a socket housing including an electronic part housing section with an open top into which all or part of an electronic part is housed; and contacts are supported by a socket housing and form an elastic contact with the terminal sections of the electronic part. The electronic part is connected to a printed circuit substrate by way of the contacts. A shield case is formed in a box shape that fits to the outer perimeter of the socket housing, and is formed integrally with a pushing section that projects inward. The shield case is fitted to the socket housing so that it is prevented from slipping off so that the pushing section pushes the electronic part toward the contacts, resulting in the electronic part being housed in the electronic part housing section.
    Type: Application
    Filed: December 7, 2004
    Publication date: September 29, 2005
    Applicant: SMK CORPORATION
    Inventors: Kiyoshi Asai, Kazuaki Kanazawa, Junichi Kobayashi
  • Patent number: D531122
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: October 31, 2006
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Junichi Kobayashi, Kazuaki Kanazawa
  • Patent number: D549658
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: August 28, 2007
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Junichi Kobayashi, Kazuaki Kanazawa
  • Patent number: D860945
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: September 24, 2019
    Assignees: DENSO Corporation, SMK Corporation
    Inventors: Kazuaki Kanazawa, Kiyoshi Asai, Takeshi Horikawa