Abstract: A solid-state imaging device includes a pixel array that is quadrilateral and includes pixels arranged in rows and columns, where each of the pixels accumulates an electric charge resulting from photoelectric conversion. The pixel array includes: a first area including first pixels for obtaining a captured image; and a second area including a second pixel for individually identifying the solid-state imaging device. The second area is provided in the vicinity of at least one corner among four corners of the pixel array, where the vicinity is a range of a predetermined number of pixels away from the at least one corner. The second pixel includes circuit elements or optical elements different from circuit elements or optical elements in each of the first pixels.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion is placed at a component insertion position, by which correction of an insertion posture of the component is performed, and the lead wire of the component that has been corrected in terms of its insertion posture is inserted into an insertion hole of a board.

Abstract: In a component insertion apparatus, there are provided a component insertion apparatus and a component insertion method capable of realizing productivity improvement by simplifying apparatus construction, downsizing the apparatus and further reducing the time required for component insertion. In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion comes to be placed at a component insertion position, by which correction of insertion posture of the component is performed, and the lead wire of the component that has been corrected in its insertion posture is inserted into an insertion hole of a board.

Abstract: In a suction nozzle (20), a sucking surface (60) is made larger in area than a to-be-sucked surface of a component (55) and is configured arbitrarily so long as a width (G1) between mutually-opposed sides parallel to a longer side (110) of the component to be sucked is smaller than a width (G2) in a direction parallel to a shorter side (111) of the component to be sucked. The suction nozzle sucks a component at its sucking surface, with a longitudinal axis (O) of the sucking surface (60) kept inclined with respect to a direction (J) in which the component is supplied.

Abstract: There is disclosed an automatic electronic part-mounting apparatus in which acceleration, acting on electronic parts, suction-held respectively by mounting heads, is reduced, thereby enabling stable mounting of the electronic parts. Cam levers 10 are pivotally mounted through respective pivot shafts 9 on a rotary member 8 which is rotated at a constant speed by a roller gear cam 19. One end of the cam lever is engaged with a fixed cam 7 whereas the other end thereof is slidably mounted through cam followers on a follower lever 12 slidably mounted on annular rails 11 in a housing 6. One end of the follower lever 12 is slidably engaged with a cam follower, and the other end of the follower lever 12 is mounted on each mounting head 13. With this construction, the acceleration of the mounting head 13 can be reduced.