Patents by Inventor Kazuaki Omi
Kazuaki Omi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6860963Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).Type: GrantFiled: December 12, 2002Date of Patent: March 1, 2005Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Patent number: 6773534Abstract: This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively.Type: GrantFiled: June 20, 2002Date of Patent: August 10, 2004Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Patent number: 6609553Abstract: This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively.Type: GrantFiled: June 20, 2002Date of Patent: August 26, 2003Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20030102082Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).Type: ApplicationFiled: December 12, 2002Publication date: June 5, 2003Inventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20030089455Abstract: This invention is to prevent a substrate from dropping when it is transferred/received to/from a separating apparatus. The support surfaces of substrate holding portions (22, 23) are made horizontal, and a substrate (21) to be separated is mounted on one substrate holding portion (22) in a horizontal state (2A). The substrate holding portions (22, 23) are pivoted about rotary shafts (26, 27), respectively, to make the support surfaces of the substrate holding portions (22, 23) vertical so that the substrate (21) is sandwiched by the substrate holding portions (22, 23) (2B) The substrate holding portions (22, 23) are rotated about rotary shafts (24, 25), respectively, and simultaneously, high-pressure, high-speed water is ejected from an ejection nozzle (28) to separate the substrate (21) into two substrates (21a, 21c). The substrate holding portions (22, 23) are pivoted about the rotary shafts (26, 27), respectively, to make the support surfaces horizontal (2C).Type: ApplicationFiled: December 9, 2002Publication date: May 15, 2003Inventors: Kiyofumi Sakaguchi, Takao Yonehara, Kazuaki Omi, Kazutaka Yanagita, Toshikazu Miyakogawa
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Patent number: 6540861Abstract: This invention is to prevent a substrate from dropping when it is transferred/received to/from a separating apparatus. The support surfaces of substrate holding portions (22, 23) are made horizontal, and a substrate (21) to be separated is mounted on one substrate holding portion (22) in a horizontal state (2A). The substrate holding portions (22, 23) are pivoted about rotary shafts (26, 27), respectively, to make the support surfaces of the substrate holding portions (22, 23) vertical so that the substrate (21) is sandwiched by the substrate holding portions (22, 23) (2B). The substrate holding portions (22, 23) are rotated about rotary shafts (24, 25), respectively, and simultaneously, high-pressure, high-speed water is ejected from an ejection nozzle (28) to separate the substrate (21) into two substrates (21a, 21c). The substrate holding portions (22, 23) are pivoted about the rotary shafts (26, 27), respectively, to make the support surfaces horizontal (2C).Type: GrantFiled: March 24, 1999Date of Patent: April 1, 2003Assignee: Canon Kabushiki KaishaInventors: Kiyofumi Sakaguchi, Takao Yonehara, Kazuaki Omi, Kazutaka Yanagita, Toshikazu Miyakogawa
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Patent number: 6521078Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (10b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).Type: GrantFiled: May 20, 2002Date of Patent: February 18, 2003Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20020157791Abstract: This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively.Type: ApplicationFiled: June 20, 2002Publication date: October 31, 2002Inventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20020157794Abstract: This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively.Type: ApplicationFiled: June 20, 2002Publication date: October 31, 2002Inventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20020134504Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).Type: ApplicationFiled: May 20, 2002Publication date: September 26, 2002Inventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Patent number: 6436226Abstract: An apparatus for separating a substrate having a porous layer at the porous layer is provided. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (108, 109) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (112) and injected against the bonded substrate stack (101), thereby physically separating the bonded substrate stack (101) into two substrates. The jet pressure is appropriately changed in accordance with progress of separation processing.Type: GrantFiled: December 15, 1998Date of Patent: August 20, 2002Assignee: Canon Kabushiki KaishaInventors: Kazuaki Omi, Takao Yonehara, Kiyofumi Sakaguchi, Kazutaka Yanagita
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Patent number: 6427747Abstract: An apparatus for separating a substrate having a porous layer from the porous layer is provided. A bonded substrate stack having a porous layer is supported by substrate holders while being rotated. A jet nozzle ejects a high-speed, high-pressure liquid or water. The jet thrusts into the bonded substrate through a guide unit. The position in the x-axis direction of this guide unit is adjusted by a motor such that the jet is concentrated into the bonding interface of the bonded substrate stack.Type: GrantFiled: June 11, 1998Date of Patent: August 6, 2002Assignee: Canon Kabushiki KaishaInventors: Kazuaki Omi, Takao Yonehara, Kiyofumi Sakaguchi, Kazutaka Yanagita
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Patent number: 6427748Abstract: This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively.Type: GrantFiled: July 22, 1999Date of Patent: August 6, 2002Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Patent number: 6418999Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).Type: GrantFiled: December 15, 1998Date of Patent: July 16, 2002Assignee: Cannon Kabushiki KaishaInventors: Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi, Kiyofumi Sakaguchi
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Publication number: 20010001975Abstract: This invention is to prevent a substrate from dropping when it is transferred/received to/from a separating apparatus. The support surfaces of substrate holding portions (22, 23) are made horizontal, and a substrate (21) to be separated is mounted on one substrate holding portion (22) in a horizontal state (2A). The substrate holding portions (22, 23) are pivoted about rotary shafts (26, 27), respectively, to make the support surfaces of the substrate holding portions (22, 23) vertical so that the substrate (21) is sandwiched by the substrate holding portions (22, 23) (2B) The substrate holding portions (22, 23) are rotated about rotary shafts (24, 25), respectively, and simultaneously, high-pressure, high-speed water is ejected from an ejection nozzle (28) to separate the substrate (21) into two substrates (21a, 21c).Type: ApplicationFiled: March 24, 1999Publication date: May 31, 2001Inventors: KIYOFUMI SAKAGUCHI, TAKAO YONEHARA, KAZUAKI OMI, KAZUTAKA YANAGITA, TOSHIKAZU MIYAKOGAWA