Abstract: Provided is a resin composition that has a low viscosity when in the state of a composition, and provides a cured product having a high thermal conductivity, a high resin strength and a high adhesive force. The composition is a thermally conductive resin composition containing: (A) 100 parts by mass of a heat-curable resin containing at least one kind selected from an epoxy resin, a cyclic imide compound and a cyanate ester resin; and (B) a thermally conductive filler that has a thermal conductivity of not smaller than 10 W/m·K, and is in an amount of 100 to 3,000 parts by mass per 100 parts by mass of the component (A), wherein the component (B) contains therein 40 to 85% by mass of a thermally conductive filler (B1) that has an average particle size of 35 to 200 ?m and a specific surface area of not larger than 0.3 mm2/g.

Abstract: Provided is a heat-curable epoxy resin composition having an excellent flexibility when in an uncured state, an excellent storage stability and moldability, a high glass-transition temperature when in the state of a cured product, and an excellent adhesive force to a metal substrate, particularly to a Cu (alloy) substrate. The heat-curable epoxy resin composition contains: (A) a crystalline epoxy resin; (B) a non-crystalline epoxy resin solid at 25° C.; (C) a phenolic compound; (D) a nitrogen atom-containing curing accelerator; (E) a reaction inhibitor; and (F) an inorganic filler.

Abstract: The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

Abstract: Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Abstract: An anisotropic heat-conductive composite silicone rubber sheet comprising: at least five heat-conductive silicone rubber layers each of which contains a heat-conductive filler and has an Asker C hardness of 2 to 30; and at least five fiber cloth layers each of which is impregnated with a silicone rubber or a silicone resin and in each of which warps comprise highly heat-conductive fibers each having a heat conductivity of 100 W/mK or more, wherein the heat-conductive silicone rubber layers and the fiber cloth layers are arranged alternately; and a method for producing the anisotropic heat-conductive composite silicone rubber sheet.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Abstract: Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

Abstract: An anisotropic heat-conductive sheet having self-adhesiveness is defined as comprising a heat-conductive layer of a cured resin composition comprising (A) a fibrous heat-conductive filler and (B) a thermosetting organopolysiloxane composition, the heat-conductive sheet having a penetration of at least 30. The heat-conductive sheet has many advantages including reliability, thermal conductivity, adhesiveness, and elongation.

Abstract: The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

Abstract: Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer. The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.

Abstract: Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.

Abstract: This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.

Abstract: An anisotropic heat-conductive composite silicone rubber sheet comprising: at least five heat-conductive silicone rubber layers each of which contains a heat-conductive filler and has an Asker C hardness of 2 to 30; and at least five fiber cloth layers each of which is impregnated with a silicone rubber or a silicone resin and in each of which warps comprise highly heat-conductive fibers each having a heat conductivity of 100 W/mK or more, wherein the heat-conductive silicone rubber layers and the fiber cloth layers are arranged alternately; and a method for producing the anisotropic heat-conductive composite silicone rubber sheet.

Abstract: Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.