Abstract: Provided is a cleaning device that can prevent reduction of an electrostatic clamping force in a vacuum state and can remove foreign matter in a vacuum processing chamber of a semiconductor manufacturing apparatus. The cleaning device includes: a foreign matter attraction unit 4 in which attraction electrodes 3 composed of a pair of electrodes are provided inside an insulator; and an attraction control unit 5 that turns on a control switch to charge the attraction electrodes and generate an electrostatic clamping force on a surface of the insulator to enable attraction of foreign matter, wherein the control switch of the attraction control unit 5 is a remotely-operable switch that is externally operable, and foreign matter in the vacuum processing chamber can be removed by an electrostatic clamping force generated in a vacuum state by turning on the control switch for the cleaning device in a vacuum closed space closed in the vacuum state.

Abstract: A bowl section of a wash-hand basin main body is provided with an overflow edge section of which part is extended upward to form an extension section. The extension section is provided with a cleaning fluid ejection port adapted to eject soapy water or the like for removing dirt and/or bacteria adhered to a user's hands. In this construction, the extension section continuously formed at a section of the overflow edge section of the bowl section functions as a conventional function case and as result, the number of parts and the number of execution man-hours can be reduced. Since a clearance or gap as seen in the prior art is not produced, cleaning efficiency can be improved. A cleaning fluid is filled in a tank, and a cleaning fluid refilling port for refilling the cleaning fluid from the tank is provided on the inner surface of a water receiving section. The cleaning fluid within the tank is supplied to the cleaning fluid ejection port by a pump.