Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

Abstract: There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.