Abstract: A thermoelectric device includes rows of thermoelectric elements, each of which includes p-type thermoelectric elements and n-type thermoelectric elements that are alternately arranged in a first direction, the n-type thermoelectric elements each having a junction area electrically connected to one of the p-type thermoelectric elements that adjoins the n-type thermoelectric element; first insulators; and a second insulator. In the thermoelectric device, the first insulators are each arranged between a corresponding one of the p-type thermoelectric elements and one of the n-type thermoelectric elements that adjoins the p-type thermoelectric element. The rows of the thermoelectric elements are arranged in a second direction perpendicular to the first direction and connected to each other.

Abstract: According to an embodiment of the present invention, there is provided a heat transport device including a working fluid, an evaporation portion, a condenser portion, a flow path portion, and an area. The working fluid includes pure water and an organic compound bearing a hydroxyl group. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The area is made of a carbon material and provided on at least one of the evaporation portion, the condenser portion, and the flow path portion.

Abstract: A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.

Abstract: According to an embodiment of the present invention, there is provided a heat transport device including an evaporation portion, a flow path, a condenser portion, and a working fluid. The evaporation portion is made of nanomaterial, and has V-shaped grooves formed on a surface. The flow path communicates with the evaporation portion. The condenser portion communicates with the evaporation portion through the flow path. The working fluid evaporates from a liquid phase to a vapor phase in the evaporation portion and condenses from the vapor phase to the liquid phase in the condenser portion.

Abstract: A semiconductor chip 36 is mounted on a package substrate 30 with its circuit side facing to a board 38. Heat is dissipated from an upper side of the semiconductor chip 36 opposite to the circuit side. A sealing resin 32 seals around the periphery of the semiconductor chip 36 so that the upper side of the semiconductor chip 36 is exposed to atmosphere. A fixing member 34 is buried in the sealing resin 32 so that a hook 40 formed on the tip of the fixing member 34 extends above the upper side of the semiconductor chip 36. A spreader 10 dissipates heat emitted from the semiconductor chip 36. A guiding slot 12 is formed on the side facing to the package substrate 30 of the spreader 10. The hooks 40 of the fixing members 34 are inserted into the guiding slots 12 respectively, and then the spreader 10 is rotated by predetermined angle against the package substrate 30. Then, the hooks 40 travel along the slots 12.

Abstract: A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.

Abstract: According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

Abstract: According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion.

Abstract: Disclosed is a light-emitting device. The light-emitting device includes an EL layer and a heat dissipation layer. The EL layer includes a first semiconductor layer, a second semiconductor layer, and an active layer, the first semiconductor layer having a first conductivity type that is one of n type and p type, the second semiconductor layer having a second conductivity type that is opposite to the first conductivity type, the active layer being provided between the first semiconductor layer and the second semiconductor layer. The heat dissipation layer has the first conductivity type and is bonded to a side of the EL layer closer to the second semiconductor layer than the first semiconductor layer.

Abstract: Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

Abstract: A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots.

Abstract: An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device so as to face a surface thereof; and a controller which drives at least one of the primary cooling unit and the auxiliary cooling unit so as to cool the electronic device.

Abstract: A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a cooling nozzle corresponding to the position. An emission time computing unit computes a coolant emission time and timing for the cooling nozzle. Upon reception of an instruction from the emission control unit, a drive unit drives a nozzle unit, thereby allowing a jet of coolant to impinge upon the electronic device.

Abstract: Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not others. One embodiment comprises an integrated circuit having multiple functional blocks (such as processor cores) and a set of thermal sensors coupled to sense the temperatures of the functional blocks. The integrated circuit includes control circuitry configured to receive signals from the thermal sensors, detect thermal events in the functional blocks and to individually adjust operation of the functional blocks to reduce the temperatures causing the thermal events. In one embodiment, the control circuitry includes a detection/control circuit coupled to each of the functional blocks and a thermal management unit configured to evaluate detected thermal events and to determine actions to be taken in response to the thermal events.

Abstract: A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots.

Abstract: A heat control apparatus for a circuit includes: a heat detecting unit which acquires the heat generation condition of a semiconductor integrated circuit from an inspection image obtained by capturing an image of the semiconductor integrated circuit by an image capturing sensor; and a cooling control unit which controls a cooling means for cooling the semiconductor integrated circuit in accordance with the acquired heat generation condition.

Abstract: A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.

Abstract: An instruction decoder identifies, for each instruction, an operational block involved in the execution of the instruction and an associated heat release coefficient. The instruction decoder stores identified information in a heat release coefficient profile. An instruction scheduler schedules the instructions in accordance with the dependence of the instructions on data. A heat release frequency adder cumulatively adds the heat release coefficient to the heat release frequency of the operational block held in the operational block heat release frequency register as the execution of the scheduled instructions proceeds. A heat release frequency subtractor subtracts from the heat release frequency of the operational blocks in the operational block heat release frequency register in accordance with heat discharge that occurs with time.

Abstract: A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period ?t. A temperature control unit estimates the temperature after the period ?t based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period ?t from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.

Abstract: An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device so as to face a surface thereof; and a controller which drives at least one of the primary cooling unit and the auxiliary cooling unit so as to cool the electronic device.