Abstract: A working method of performing work with increase or decrease in weight on an object by a robot system having a robot, a first hand with an assist device, and a second hand without the assist device, includes switching between an assisted work state in which the first hand is coupled to the robot and work is performed with assistance by the assist device and a non-assisted work state in which the second hand is coupled to the robot and work is performed without assistance by the assist device according to a weight of the object.

Abstract: A working method of performing work with increase or decrease in weight on an object by a robot system having a robot, a first hand with an assist device, and a second hand without the assist device, includes switching between an assisted work state in which the first hand is coupled to the robot and work is performed with assistance by the assist device and a non-assisted work state in which the second hand is coupled to the robot and work is performed without assistance by the assist device according to a weight of the object.

Abstract: A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate.

Abstract: A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate.

Abstract: A nozzle plate includes a silicon substrate, and a nozzle hole formed in the silicon substrate for discharging a liquid droplet provided with: a first nozzle portion formed perpendicularly to a surface of the silicon substrate; a second nozzle portion formed on a same axis as an axis of the first nozzle portion and having a cross-sectional area that is larger than a cross-sectional area of the first nozzle portion; and an inclined portion having a cross-sectional area gradually increasing from the first nozzle portion to the second nozzle portion.

Abstract: A droplet discharge head including a nozzle substrate having nozzle openings, a cavity substrate having discharge chambers that communicate with the nozzle openings and discharge droplets from the nozzle openings, a reservoir substrate having a reservoir concave portion that serves as a reservoir which communicates commonly with the discharge chambers. The reservoir substrate is provided between the nozzle substrate and the cavity substrate and a resin thin film is formed on a whole inner face of the reservoir concave portion and on a bottom face of a second concave portion. The second concave portion is provided in a peripheral of the reservoir concave portion and has a depth which is smaller than the depth of the reservoir concave portion. The resin thin film is cut circularly so as to surround the reservoir concave portion, and a part of the resin thin film serves as a diaphragm buffering pressure variation. serves as a diaphragm buffering pressure variation.

Abstract: A droplet discharge head, includes: a nozzle substrate having a plurality of nozzles, each of the plurality of nozzles discharging a droplet; a cavity substrate including a discharge chamber communicating with the nozzle and having a vibration plate formed at part thereof, an individual electrode that is formed to the vibration plate and is provided in a plurality of numbers so that each individual electrode corresponds to one of the nozzles, and an insulation layer formed between the individual electrodes; an electrode substrate having a common electrode formed at a position facing the vibration plate; and a member sandwiched between the cavity substrate and the electrode substrate so as to form a gap.

Abstract: A droplet discharging head includes: a nozzle substrate that has a plurality of nozzle holes; a cavity substrate that communicates with the nozzle holes and which has a plurality of independent discharge chambers, the discharge chambers generating pressure therein so as to discharge droplets through the nozzle holes; a reservoir substrate that has a reservoir concave section and is provided between the nozzle substrate and the cavity substrate, the reservoir concave section functioning a reservoir, the reservoir being shared for communicating with the discharge chambers; a resin thin film formed on an entire inner surface of the reservoir concave section by film deposition, the resin thin film not being formed in the reservoir substrate on a side of an adhesion interface with the nozzle substrate or the cavity substrate; and a bottom surface of the reservoir concave section functioning a diaphragm section, the diaphragm section including the resin thin film and buffering pressure fluctuation.

Abstract: A nozzle plate includes a silicon substrate, and a nozzle hole formed in the silicon substrate for discharging a liquid droplet provided with: a first nozzle portion formed perpendicularly to a surface of the silicon substrate; a second nozzle portion formed on a same axis as an axis of the first nozzle portion and having a cross-sectional area that is larger than a cross-sectional area of the first nozzle portion; and an inclined portion having a cross-sectional area gradually increasing from the first nozzle portion to the second nozzle portion.

Abstract: A droplet discharge head, including: a nozzle substrate having a nozzle opening, the nozzle opening being provided in a plural number; a cavity substrate having a discharge chamber that communicates the nozzle opening and discharges a droplet from the nozzle opening, the discharge chamber is provided in a plural number, and each of the discharge chambers independently communicating with the corresponding nozzle opening; a reservoir substrate having a reservoir concave portion that serves as a reservoir which communicates commonly with the discharge chambers, the reservoir substrate being provided between the nozzle substrate and the cavity substrate; and a resin thin film formed on a whole inner face of the reservoir concave portion and on a bottom face of a second concave portion, the second concave portion being provided in a peripheral of the reservoir concave portion and having a depth smaller than a depth of the reservoir concave portion, wherein the resin thin film provided on the bottom face of the

Abstract: A droplet discharging head includes: a nozzle substrate that has a plurality of nozzle holes; a cavity substrate that communicates with the nozzle holes and which has a plurality of independent discharge chambers, the discharge chambers generating pressure therein so as to discharge droplets through the nozzle holes; a reservoir substrate that has a reservoir concave section and is provided between the nozzle substrate and the cavity substrate, the reservoir concave section functioning a reservoir, the reservoir being shared for communicating with the discharge chambers; a resin thin film formed on an entire inner surface of the reservoir concave section by film deposition, the resin thin film not being formed in the reservoir substrate on a side of an adhesion interface with the nozzle substrate or the cavity substrate; and a bottom surface of the reservoir concave section functioning a diaphragm section, the diaphragm section including the resin thin film and buffering pressure fluctuation.

Abstract: A droplet discharging head at least containing a plurality of droplet-discharging nozzle holes to discharge droplets, a plurality of independent droplet discharging chambers that communicate with the respective droplet-discharging nozzle holes and discharge droplets from the droplet-discharging nozzle holes using pressure generated in the chambers, an discharging mechanism for droplet discharging composed of a droplet discharging actuator that is provided at a portion of each of the droplet discharging chambers to generate pressure in the droplet discharging chambers, and a reservoir that communicates commonly with the droplet discharging chambers via an orifice provided at each of the droplet discharging chambers, including: a bubble discharging mechanism for bubble discharge that shares the same reservoir with the droplet discharging mechanism for droplet discharging.

Abstract: A liquid drop discharge head of four-layer structure according to an aspect of the invention including: a nozzle substrate having a plurality of nozzle holes; a cavity substrate having a plurality of independent discharge chambers that communicate with the respective nozzle holes and generate a pressure in the chambers for discharging liquid drops through the nozzle holes; and a reservoir substrate forming a reservoir space that communicates commonly with the discharge chambers, wherein the reservoir substrate has a diaphragm portion provided by reducing the thickness of a part of a wall surface forming the reservoir space.

Abstract: A liquid-jet head includes a nozzle substrate, a cavity substrate, and a reservoir substrate. The nozzle substrate has nozzle holes through which liquid is jetted as droplets. The cavity substrate includes a vibration plate for pressurizing the liquid and first recesses corresponding to the nozzle holes. The reservoir has a second recess serving as a reservoir for storing liquid, delivering holes formed in the bottom of the second recess, nozzle communication holes communicating with the nozzle holes, and third recesses formed on the opposite side to the second recess. The reservoir substrate is bonded to the cavity substrate so that the third recesses are coupled with the respective first recesses to define discharge chambers, and the nozzle communication holes allow the nozzle holes to communicate with the respective discharge chambers.

Abstract: A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface treatment apparatus 1 are conveyed to the inside of a decompression chamber to decompress a plurality of concave portions 32 (enclosed spaces); a second step in which the surface treatment apparatus 1 and the substrate 10 are brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrate 10 is being attracted to the surface treatment apparatus 1 with the use of a difference between negative pressure inside the concave portions 32 and atmospheric pressure; and a third step in which the surface treatment is carried out to a back surface 101 of the substrate 10 with the substrate 10 being attracted by the surface treatment apparatus 1.

Abstract: A method of producing an electrode substrate is provided that can form at least one recess of various configurations on an electrode substrate through a simplified process and with an increased degree of precision. Also provided are an electrode substrate produced by the method, an electrostatic actuator provided with the electrode substrate, a liquid droplet ejecting head provided with the actuator and a liquid droplet ejecting apparatus provided with the head. The method comprises a first step of forming at least one recess 41 on a glass substrate 4a through a press forming process in which a pressing mold is pressed against the glass substrate, and a second step of providing an electrode 42 on a bottom surface of each recess 41. The press forming process is preferably carried out under a condition that the substrate is heated up to a temperature of 350 to 800° C. It is desirable that the glass composing the glass substrate 4a has a coefficient of thermal expansion in the range of 20×10?7 to 90×10?7° C.?1.

Abstract: A surface treatment apparatus 1 is constructed to hold a substrate 10 when surface treatment is carried out to a back surface 101 of the substrate 10. The surface treatment apparatus 1 includes at least one enclosed space each defined by a concave portion 32 and a front surface 102 of the substrate 10; and an O-ring 2 (contact portion) adapted to hermetically contact with the front surface 102 of the substrate 10 to produce negative pressure in cooperation with the O-ring 2 and the front surface 102 of the substrate 10. The surface treatment apparatus 1 is constructed so that the substrate 10 is attracted onto the surface treatment apparatus 1 using a difference between the negative pressure and atmospheric pressure by decompressing the enclosed space in a decompression chamber and then bringing out the substrate 10 from the inside of the decompression chamber to environment under atmospheric pressure.

Abstract: A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface treatment apparatus 1 are conveyed to the inside of a decompression chamber to decompress a plurality of concave portions 32 (enclosed spaces); a second step in which the surface treatment apparatus 1 and the substrate 10 are brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrate 10 is being attracted to the surface treatment apparatus 1 with the use of a difference between negative pressure inside the concave portions 32 and atmospheric pressure; and a third step in which the surface treatment is carried out to a back surface 101 of the substrate 10 with the substrate 10 being attracted by the surface treatment apparatus 1.