Patents by Inventor Kazufumi Tanaka

Kazufumi Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7745345
    Abstract: A manufacture method for a ZnO based semiconductor device includes the steps of: (a) preparing a ZnO based semiconductor wafer including a ZnO based semiconductor substrate having a wurzeit structure with a +C plane on one surface and a ?C plane on an opposite surface, a first ZnO based semiconductor layer having a first conductivity type epitaxially grown above the +C plane of the ZnO based semiconductor substrate, and a second ZnO based semiconductor layer having a second conductivity type opposite to the first conductivity type epitaxially grown above the first semiconductor layer; and (b) wet-etching the ZnO based semiconductor wafer with acid etching liquid to etch the ?C plane of the ZnO based semiconductor substrate
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: June 29, 2010
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Naochika Horio, Kazufumi Tanaka
  • Publication number: 20090124042
    Abstract: A manufacture method for a ZnO based semiconductor device includes the steps of: (a) preparing a ZnO based semiconductor wafer including a ZnO based semiconductor substrate having a wurzeit structure with a +C plane on one surface and a ?C plane on an opposite surface, a first ZnO based semiconductor layer having a first conductivity type epitaxially grown above the +C plane of the ZnO based semiconductor substrate, and a second ZnO based semiconductor layer having a second conductivity type opposite to the first conductivity type epitaxially grown above the first semiconductor layer; and (b) wet-etching the ZnO based semiconductor wafer with acid etching liquid to etch the ?C plane of the ZnO based semiconductor substrate
    Type: Application
    Filed: November 5, 2008
    Publication date: May 14, 2009
    Applicant: Stanley Electric Co., Ltd.
    Inventors: Naochika HORIO, Kazufumi TANAKA
  • Patent number: 7497829
    Abstract: A ring buffer records image data output from an ultrasound diagnosis device in units of frames. A user identifies, on an image, occurrence of a target symptom while viewing a cross sectional image which is displayed in real time and inputs an end trigger immediately after the symptom occurs. When the end trigger is input, a system controller unit instructs a recording controller unit for recording of image data. The recording controller unit sets a recording start time from the time when the end trigger is input and extracts data corresponding to a period from the recording start time to the time when the end trigger is input from the ring buffer as data to be recorded. A data process is applied to the data to be recorded in a data processor unit and recorded on a recording medium.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: March 3, 2009
    Assignee: Aloka Co., Ltd.
    Inventors: Akifumi Ohtake, Kazufumi Tanaka
  • Publication number: 20050124893
    Abstract: A ring buffer records image data output from an ultrasound diagnosis device in units of frames. A user identifies, on an image, occurrence of a target symptom while viewing a cross sectional image which is displayed in real time and inputs an end trigger immediately after the symptom occurs. When the end trigger is input, a system controller unit instructs a recording controller unit for recording of image data. The recording controller unit sets a recording start time from the time when the end trigger is input and extracts data corresponding to a period from the recording start time to the time when the end trigger is input from the ring buffer as data to be recorded. A data process is applied to the data to be recorded in a data processor unit and recorded on a recording medium.
    Type: Application
    Filed: October 14, 2004
    Publication date: June 9, 2005
    Inventors: Akifumi Ohtake, Kazufumi Tanaka
  • Patent number: 5961902
    Abstract: A multilayer article such as a door trim board is fabricated by the steps of extruding melted resin layers (13m), (12m) and (11m) respectively forming a soft skin material (13), a foamed soft intermediate layer (12) and a base member (11) in the form of a multilayer resin sheet from a die-head (40) of an extruding machine, supply the extruded multilayer resin sheet to a molding machine in such a manner that the resin layer for the skin material is placed on a lower molding die of the molding machine and molding the resin layers in the form of the multilayer article. The resin layer for the skin material consists of thermoplastic elastomer, the resin layer for the intermediate layer consists of ethylenic copolymer copolymerized with ethylene and at least radical copolymerizable acid anhydride, and the resin layer for the base member consists of olefinic resin.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: October 5, 1999
    Assignees: Araco Kabushiki Kaisha, Showa Denko Kabushiki Kaisha
    Inventors: Katsunori Ishitoya, Minoru Takaishi, Michihiro Okochi, Hideyuki Iwamoto, Sakuyoshi Nakagami, Kazufumi Tanaka