Abstract: It is aimed to provide an optical node, a remote control system, and a remote control method capable of improving a communication speed of an uplink signal.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent or using almost no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) an oxyalkylene polymer containing 0.3 to 0.7 equivalent of a hydrolyzable silyl group in each molecule and having a number average molecular weight of 15,000 to 100,000 (hydrolyzable silyl group-containing polymer); (B) a tackifier resin; (C) a curing catalyst.

Abstract: The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent or using almost no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) an oxyalkylene polymer containing 0.3 to 0.7 equivalent of a hydrolyzable silyl group in each molecule and having a number average molecular weight of 15,000 to 100,000 (hydrolyzable silyl group-containing polymer); (B) a tackifier resin; (C) a curing catalyst.

Abstract: The vertical sync signal generator includes: a vertical sync signal separation circuit for separating a vertical sync signal of an input luminance signal and outputting the separated signal as a first vertical sync signal; an automatic frequency control circuit for generating a second vertical sync signal having a repeat frequency corresponding with an average repeat frequency of the first vertical sync signal and outputting the generated signal; a vertical sync signal phase detection circuit for detecting whether or not the first vertical sync signal has two different periods repeated alternately and outputting the detection result as a decision signal; and a selector for receiving the first and second vertical sync signals, selecting the first vertical sync signal when the decision signal indicates that the first vertical sync signal has two different periods repeated alternately and otherwise selecting the second vertical sync signal and outputting the selected signal.

Abstract: An antifungal composition comprising 3-iodo-2-propynyl butylcarbamate, 4,5-dichloro-2-octyl-isothiazolin-3-one and methyl 2-benzimidazolylcarbamate is useful as industrial antifungal composition, particularly for wood protection.

Abstract: An antifungal composition comprising 3-iodo-2-propynyl butylcarbamate, 4,5-dichloro-2-octyl-isothiazolin-3-one and methyl 2-benzimidazolylcarbamate is useful as industrial antifungal composition, particularly for wood protection.

Abstract: An unsaturated polyester resin composition comprising:(a) 30 to 99% by weight of an unsaturated polyester resin comprising a crosslinking monomer and an unsaturated alkyd obtained by reacting at least dicyclopentadiene (hereinafter abbreviated as "DCPD"), an unsaturated polycarboxylic acid and a polyhydric alcohol, and(b) 1 to 70% by weight of a hardness adjusting unsaturated polyester resin.Sheets of base material can be impregnated with the resin composition effectively to give a laminate which is satisfactorily punchable at low temperatures and yet has high resistance to thermal softening and outstanding electrical characteristics.