Abstract: A laser processes a circuit board including at least two layers. The two layers are a conductive layer with a plurality of holes and an insulating layer. The conductive layer is disposed on a surface layer of the insulating layer which is to be processed by applying a laser beam to portions of the insulating layer corresponding to the holes of the conductive layer. The circuit board is irradiated with the laser beam, and a reflected laser beam is detected, whereby the laser processing of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value differing from a desired value. Also, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs.

Abstract: A laser processing method is presented for processing a circuit board including at least two layers, having a conductive layer with a plurality of holes disposed on a surface layer of insulating layer to be processed by applying laser beam to an insulating layer corresponding to holes of the conductive layer. In this laser processing method or apparatus, a circuit board is irradiated with a laser beam, and a reflected laser beam is detected, whereby the laser process of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value out of a desired value. Also in this laser processing method or apparatus, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining.