Abstract: The objectives of the present invention are to provide an oxidation-resistant rare earth metal-based magnet powder useful for producing rare earth metal-based bonded magnet which is not only excellent in oxidation resistance but also superior in magnetic characteristics and a method for producing the same, a compound for rare earth metal-based bonded magnet, a rare earth metal-based bonded magnet and a method for producing the same. The oxidation-resistant rare earth metal-based magnet powder of the present invention is characterized in that it has on its surface an adhesion layer containing a pigment as a primary component.

Abstract: The integrated magnet body according to the invention is an integrated magnet body formed by laminating and securing a plurality of pieces of magnet through an insulating film between pieces of magnet, characterized in that the insulating film has a film thickness of 0.01 &mgr;m or more, and a ratio of a total sum of the thickness of the insulating films to an overall length in the laminating direction of the integrated magnet body is in a range of from 0.0005 to 3%. The integrated magnet body according to the invention is excellent in insulating property and effective volume ratio and thus can attain high efficiency of a motor by installing the integrated magnet body in the motor.

Abstract: The integrated magnet body according to the invention is an integrated magnet body formed by laminating and securing a plurality of pieces of magnet through an insulating film between pieces of magnet, characterized in that the insulating film has a film thickness of 0.01 &mgr;m or more, and a ratio of a total sum of the thickness of the insulating films to an overall length in the laminating direction of the integrated magnet body is in a range of from 0.0005 to 3%. The integrated magnet body according to the invention is excellent in insulating property and effective volume ratio and thus can attain high efficiency of a motor by installing the integrated magnet body in the motor.

Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.

Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.

Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

Abstract: A continuous multi-layer plating line for steel sheet which includes a hot-galvanizing apparatus to form a galvanized coating and optionally to alloy the coating and an electroplating apparatus to form an electroplated coating on the galvanized coating. Between the hot-galvanizing apparatus and the electroplating apparatus, a post-galvanizing surface treatment apparatus effective for removing surface oxide contaminants and activating the surface of the galvanized coating is disposed and the galvanized steel sheet is treated thereby prior to electroplating. The post-galvanizing surface treatment may be carried out by applying an alkali solution or an acid which can dissolve aluminum oxide to the galvanized coating, by alkali electrolysis, by cathodic electrolysis, by cooling the galvanized steel sheet with an alkali solution, or by skin-pass rolling using an alkali solution or an acid which can dissolve aluminum oxide as a skin-pass roling liquid.